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Patent Searching and Data


Title:
SEALED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2010/084597
Kind Code:
A1
Abstract:
A sealed structure which includes bonding surfaces of at least two members (2, 3, and 6) and in which sealing has been attained by interposing between the bonding surfaces a pasty gasket (20) having the property of solidifying into an elastic state after application to adhere to the adherend(s). The pasty gasket (20) is caused to tenaciously adhere to one (6) of the members which is made of a material to which the pasty gasket (20) is less apt to adhere, to thereby improve the sealability of the bonding parts of the at least two members (2, 3, and 6). The bonding surface of at least one (6) of at least two members (2, 3, and 6) is made of a material having a low functional-group density. A thermal-spraying metal deposit (21) has been formed on the bonding surface of this member (6). The pasty gasket (20) has been adhered to the thermal-spraying metal deposit (21).

Inventors:
YAMAZAKI, Takahiro (1 Toyota-cho, Toyota-sh, Aichi 71, 47185, JP)
山崎 喬裕 (〒71 愛知県豊田市トヨタ町1番地 トヨタ自動車株式会社内 Aichi, 47185, JP)
Application Number:
JP2009/051038
Publication Date:
July 29, 2010
Filing Date:
January 23, 2009
Export Citation:
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Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA (1 Toyota-cho, Toyota-shi Aichi, 71, 47185, JP)
トヨタ自動車株式会社 (〒71 愛知県豊田市トヨタ町1番地 Aichi, 47185, JP)
YAMAZAKI, Takahiro (1 Toyota-cho, Toyota-sh, Aichi 71, 47185, JP)
International Classes:
F16J15/14; F02F11/00; F16J15/10
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (Sumitomoseimei Midosuji Bldg, 14-3 Nishitemma 4-chome,,Kita-ku, Osaka-sh, Osaka 47, 53000, JP)
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