Title:
SEALED-TYPE ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/107358
Kind Code:
A1
Abstract:
A sealed-type electronic device, provided with: first substrates (2, 3) placed on a base plate (1) located in a sealed casing as a lower layer, the first substrates (2, 3) carrying a plurality of elements including heat-generating elements (4, 5, 6, 7); second substrates (10, 11) placed on an upper plate (8) located in the casing as a layer above the base plate, the second substrates (10, 11) carrying a plurality of elements; and a blower (12) placed on the upper plate, the blower blowing a cooling airflow towards the heat-generating elements.
Inventors:
MIWA TAKAYUKI (JP)
Application Number:
PCT/JP2018/043601
Publication Date:
June 06, 2019
Filing Date:
November 27, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K7/20; H01L23/467
Domestic Patent References:
| WO2016076214A1 | 2016-05-19 |
Foreign References:
| JP2015021725A | 2015-02-02 | |||
| JPH07221478A | 1995-08-18 | |||
| JP2008140802A | 2008-06-19 | |||
| JP2016111250A | 2016-06-20 | |||
| JPH1169774A | 1999-03-09 | |||
| JPS5473272A | 1979-06-12 |
Attorney, Agent or Firm:
FUKUI Hiroshi (JP)
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