Title:
SEALING COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/124391
Kind Code:
A1
Abstract:
This sealing composition contains an epoxy resin, a curing agent, and an inorganic filler that includes particles of an inorganic material having a Mohs hardness of 8 or higher and particles of an inorganic material having a Mohs hardness of 5 or lower.
Inventors:
YAMAURA MASASHI (JP)
KANG DONGCHUL (JP)
ISHIBASHI KENTA (JP)
KODAMA TAKUYA (JP)
TANAKA MIKA (JP)
HORI KEICHI (JP)
KANG DONGCHUL (JP)
ISHIBASHI KENTA (JP)
KODAMA TAKUYA (JP)
TANAKA MIKA (JP)
HORI KEICHI (JP)
Application Number:
PCT/JP2018/046611
Publication Date:
June 27, 2019
Filing Date:
December 18, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08K3/013; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
| WO2013146700A1 | 2013-10-03 | |||
| WO2013100174A1 | 2013-07-04 | |||
| WO2014208694A1 | 2014-12-31 |
Foreign References:
| JP2016000784A | 2016-01-07 | |||
| JPH04192446A | 1992-07-10 | |||
| JPH03273039A | 1991-12-04 | |||
| JP2016079304A | 2016-05-16 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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