Title:
SEALING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/073142
Kind Code:
A1
Abstract:
Disclosed is a sealing composition containing no lead which enables sealing at low temperatures and has a smaller coefficient of thermal expansion (thermal expansivity). The sealing composition does not substantially contain Pb and is composed of 80-98 weight% of a glass powder and 2-20 weight% of an inorganic filler containing a zirconium phosphate compound. The glass powder contains 70-85 weight% of Bi2O3, 4.5-10 weight% of B2O3, 8.0-20 weight% of ZnO and 0.1-1 weight% of Al2O3 in terms of oxides.
Inventors:
MAYUMI YOSHITAKA (JP)
FUJIMOTO TSUYOSHI (JP)
TAGUCHI TOMOYUKI (JP)
TANIGAMI YOSHINORI (JP)
FUJIMOTO TSUYOSHI (JP)
TAGUCHI TOMOYUKI (JP)
TANIGAMI YOSHINORI (JP)
Application Number:
PCT/JP2005/001110
Publication Date:
August 11, 2005
Filing Date:
January 27, 2005
Export Citation:
Assignee:
NIHON YAMAMURA GLASS CO LTD (JP)
MAYUMI YOSHITAKA (JP)
FUJIMOTO TSUYOSHI (JP)
TAGUCHI TOMOYUKI (JP)
TANIGAMI YOSHINORI (JP)
MAYUMI YOSHITAKA (JP)
FUJIMOTO TSUYOSHI (JP)
TAGUCHI TOMOYUKI (JP)
TANIGAMI YOSHINORI (JP)
International Classes:
C03C8/24; (IPC1-7): C03C8/24
Foreign References:
| JP2003095697A | 2003-04-03 | |||
| JP2002037644A | 2002-02-06 |
Attorney, Agent or Firm:
Murota, Rikio (101 Edomachi, Chuo-k, Kobe-shi Hyogo 33, JP)
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