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Patent Searching and Data


Title:
SEALING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/073142
Kind Code:
A1
Abstract:
Disclosed is a sealing composition containing no lead which enables sealing at low temperatures and has a smaller coefficient of thermal expansion (thermal expansivity). The sealing composition does not substantially contain Pb and is composed of 80-98 weight% of a glass powder and 2-20 weight% of an inorganic filler containing a zirconium phosphate compound. The glass powder contains 70-85 weight% of Bi2O3, 4.5-10 weight% of B2O3, 8.0-20 weight% of ZnO and 0.1-1 weight% of Al2O3 in terms of oxides.

Inventors:
MAYUMI YOSHITAKA (JP)
FUJIMOTO TSUYOSHI (JP)
TAGUCHI TOMOYUKI (JP)
TANIGAMI YOSHINORI (JP)
Application Number:
PCT/JP2005/001110
Publication Date:
August 11, 2005
Filing Date:
January 27, 2005
Export Citation:
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Assignee:
NIHON YAMAMURA GLASS CO LTD (JP)
MAYUMI YOSHITAKA (JP)
FUJIMOTO TSUYOSHI (JP)
TAGUCHI TOMOYUKI (JP)
TANIGAMI YOSHINORI (JP)
International Classes:
C03C8/24; (IPC1-7): C03C8/24
Foreign References:
JP2003095697A2003-04-03
JP2002037644A2002-02-06
Attorney, Agent or Firm:
Murota, Rikio (101 Edomachi, Chuo-k, Kobe-shi Hyogo 33, JP)
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