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Title:
SEALING DEVICE, BLISTER PACKAGING MACHINE, AND BLISTER PACK MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/014267
Kind Code:
A1
Abstract:
Provided are a blister packaging machine and a blister pack manufacturing method that can flexibly respond to changes in product size and quantity while controlling increases in manufacturing costs. A blister pack 1 comprises a container film 2 that has a pocket section 2A and a flange section 2B, and a cover film 3 that has a top layer film 3A and a bottom layer film 3B. During manufacturing of the blister pack 1, the bottom layer film 3B is caused to expand toward the space inside the pocket section 2A by supplying gas between the films 3A, 3B via a through-hole 3C formed in the top layer film 3A after pressure welding the cover film 3 on the flange section 2B in a first annular region R1. Then, the cover film 3 is attached to the flange section 2B so that the space between the films 3A, 3B is in a non-communicating, air-tight state with respect to the through-hole 3C in a second annular region R2 that is closer to the inner circumference than the first annular region R1.

Inventors:
NODA Naohiko (250 Ouji 2-chome, Komaki-sh, Aichi 51, 〒4858551, JP)
YANO Masashi (250 Ouji 2-chome, Komaki-sh, Aichi 51, 〒4858551, JP)
Application Number:
JP2016/071412
Publication Date:
January 26, 2017
Filing Date:
July 21, 2016
Export Citation:
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Assignee:
CKD CORPORATION (250 Ouji 2-chome, Komaki-shi Aichi, 51, 〒4858551, JP)
International Classes:
B65B9/04; B65B7/28
Foreign References:
JP2014125247A2014-07-07
JPS53146678U1978-11-18
US20110271643A12011-11-10
DE102011015561A12012-10-04
Attorney, Agent or Firm:
KAWAGUCHI Mitsuo (48KT Bldg. 302, 9-37 Meieki 3-chome, Nishi-ku, Nagoya-sh, Aichi 45, 〒4510045, JP)
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