Title:
SEALING FILM, SEALING METHOD FOR ELECTRONIC COMPONENT MOUNTED SUBSTRATE, AND ELECTRONIC COMPONENT MOUNTED SUBSTRATE COATED WITH SEALING FILM
Document Type and Number:
WIPO Patent Application WO/2018/008657
Kind Code:
A1
Abstract:
A sealing film 100 according to the present invention is used for sealing an electronic component mounted substrate 45 that is provided with a substrate 5 and an electronic component 4 mounted on one surface side of the substrate 5, and is provided with: an insulating layer 12; and an electromagnetic wave shield layer 13. The insulating layer 12 and the electromagnetic wave shield layer 13 contain resin materials, and the elongation rate of the sealing film 100 at a softening point required on the basis of JIS K 6251 is 150-3500%. The electromagnetic wave shield layer 13 can be configured by being provided with a projected part that projects beyond the end of the insulating layer 12.
Inventors:
HASHIMOTO AKINORI (JP)
WATANABE MASAHIKO (JP)
SHIRAISHI FUMIHIRO (JP)
WATANABE MASAHIKO (JP)
SHIRAISHI FUMIHIRO (JP)
Application Number:
PCT/JP2017/024556
Publication Date:
January 11, 2018
Filing Date:
July 04, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H05K3/28; H01L21/56; H01L23/00; H01L23/28; H01L23/29; H01L23/31; H05K1/02; H05K9/00
Domestic Patent References:
| WO2014027672A1 | 2014-02-20 | |||
| WO2008026247A1 | 2008-03-06 |
Foreign References:
| JP2014078698A | 2014-05-01 | |||
| JP2014080489A | 2014-05-08 | |||
| US20100108370A1 | 2010-05-06 | |||
| JP2006135020A | 2006-05-25 | |||
| GB2254193A | 1992-09-30 | |||
| US5557064A | 1996-09-17 | |||
| JP2013147589A | 2013-08-01 | |||
| JP2003273571A | 2003-09-26 |
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
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