Title:
SEALING FILM AND METHOD FOR SEALING ELEMENT FOR ORGANIC ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/2014/119417
Kind Code:
A1
Abstract:
Provided are: a sealing film which comprises a polar group and still has water repellency, and which firmly adheres to an element for organic electronic devices even if heated at low temperatures and has a function of protecting the element for organic electronic devices from moisture; and a method for sealing an element for organic electronic devices with use of this sealing film.
This sealing film is characterized by having a sealing layer that is formed from an adhesive composition that contains: a polymer or oligomer containing 80% or more of an aliphatic saturated hydrocarbon in a repeating unit; and an organic acid having a number average molecular weight of 300 or more, or an anhydride of the organic acid. This sealing film is also characterized in that: the polymer or oligomer contains at least one compound that contains a cyclic aliphatic saturated hydrocarbon in a repeating unit; the adhesive composition has an apparent acid value of 1.2-45 mgCH3ONa/g; and the surface of the sealing layer has a contact angle with water of 99° or more.
Inventors:
MIHARA NAOAKI (JP)
ISHIGURO KUNIHIKO (JP)
MIEDA TETSUYA (JP)
ISHIGURO KUNIHIKO (JP)
MIEDA TETSUYA (JP)
Application Number:
PCT/JP2014/050991
Publication Date:
August 07, 2014
Filing Date:
January 20, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J7/20; H05B33/04; C09J11/00; C09J151/04; C09J151/06; C09J201/02; C09J201/08; H01L51/50; H05B33/10
Domestic Patent References:
| WO2011062167A1 | 2011-05-26 | |||
| WO2005033035A1 | 2005-04-14 | |||
| WO2012062586A1 | 2012-05-18 |
Foreign References:
| US20100252192A1 | 2010-10-07 |
Attorney, Agent or Firm:
MATSUSHITA, Makoto et al. (JP)
Matsushita 亮 (JP)
Matsushita 亮 (JP)
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