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Patent Searching and Data


Title:
SEALING FILM, SEALED STRUCTURE, AND METHOD FOR MANUFACTURING SEALED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/199306
Kind Code:
A1
Abstract:
Provided is a sealing film made of a resin composition comprising a thermosetting resin that has a structural unit represented by formula (1), and an inorganic filler: [in formula (1), X1 denotes a reactive functional group and R1 denotes a C2-25 hydrocarbon group].

Inventors:
WATASE YUSUKE (JP)
NOMURA YUTAKA (JP)
ISHIGE HIROYUKI (JP)
SUZUKI MASAHIKO (JP)
Application Number:
PCT/JP2018/017256
Publication Date:
November 01, 2018
Filing Date:
April 27, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/40; C08G8/12; C08G8/24; C08J5/18; C08L61/14; C08L63/00; H01L23/28; H01L23/29; H01L23/31; H03H3/08; H03H9/25
Domestic Patent References:
WO2016052290A12016-04-07
Foreign References:
JP2013082785A2013-05-09
JPH06322348A1994-11-22
JP2015089940A2015-05-11
JP2012182407A2012-09-20
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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