Title:
SEALING GLASS, GLASS MEMBER HAVING SEALING MATERIAL LAYER, AND ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/067848
Kind Code:
A1
Abstract:
The sealability and reliability of an electronic device are improved by improving with good reproducibility the adhesive strength obtained by laser sealing with a glass substrate formed from soda lime glass. A glass substrate (3) has a sealing region. A sealing material layer (5) formed from a baked layer of a sealing glass material comprising a sealing glass, a low-expansion filler, and a laser absorbing material is disposed in the sealing region. The sealing glass comprises, by mass ratio, 70 to 90% of Bi2O3, 1 to 20% of ZnO, 2 to 12% of B2O3, and 10 to 380 ppm of Na2O. This type of glass substrate (3) and a glass substrate (2) having an element-forming region consisting of electronic elements are laminated, the sealing material layer (5) is melted by exposure to a laser light (6), and the glass substrates (2) and (3) are thereby sealed together.
Inventors:
KAWANAMI SOHEI (JP)
Application Number:
PCT/JP2009/070703
Publication Date:
June 17, 2010
Filing Date:
December 10, 2009
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
KAWANAMI SOHEI (JP)
KAWANAMI SOHEI (JP)
International Classes:
C03C8/04; C03C8/08; C03C27/10; H01J9/26; H01L51/50; H05B33/04
Foreign References:
| DE102007025465B3 | 2008-09-25 | |||
| JP2008098147A | 2008-04-24 | |||
| JP2007031258A | 2007-02-08 | |||
| JP2004238273A | 2004-08-26 | |||
| JP2006524419A | 2006-10-26 | |||
| JP2008115057A | 2008-05-22 | |||
| JP2008059802A | 2008-03-13 | |||
| JP2003128430A | 2003-05-08 | |||
| JP2006137637A | 2006-06-01 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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