Title:
SEALING LIGHTING DEVICE COMPONENT ASSEMBLY WITH SOLDER GLASS PREFORM BY USING INFRARED RADIATION
Document Type and Number:
WIPO Patent Application WO2004042765
Kind Code:
A3
Abstract:
Disclosed is a method for sealing and affixing a component assembly for an electrical lighting device to a glass lamp envelope. The assembly used in the process comprises the component, such as an electrode lead wire and a solder glass perform. The process is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300°C in the range of 30-45x10-7 °C-1.
Inventors:
CANALE JOSEPH E
HAYNES WILLIAM L
COOCH STEPHEN L
TUTTLE CLAYTON L II
HAYNES WILLIAM L
COOCH STEPHEN L
TUTTLE CLAYTON L II
Application Number:
PCT/US2003/033417
Publication Date:
August 12, 2004
Filing Date:
October 22, 2003
Export Citation:
Assignee:
CORNING INC (US)
International Classes:
H01J9/26; H01J9/32; (IPC1-7): H01J9/26; H01J9/32; H01J61/36; C03C8/24
Foreign References:
| US6432853B1 | 2002-08-13 | |||
| GB484555A | 1938-05-06 | |||
| US4328022A | 1982-05-04 | |||
| US6166491A | 2000-12-26 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 06 30 June 1997 (1997-06-30)
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