Title:
SEALING MATERIAL COMPOSITION AND SEALING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/008257
Kind Code:
A1
Abstract:
To provide a sealing material for affixing to an electronic element provided to an electronic substrate or the like or a portion where metal is exposed and protecting the electronic element or other adherend from moisture and the like, and an uncured sealing material composition for the same, the sealing material and the sealing material composition having fixed-shape properties, flexibility, and adhesive properties. The present invention is a sealing material composition having as essential components an epoxy resin cured material having a flexible skeleton, a monofunctional (meth)acrylate ester monomer, a photoradical polymerization initiator, and a styrene-based elastomer, the monofunctional (meth)acrylate ester monomer being curable by photoirradiation, and the sealing material composition having fixed-shape properties and flexibility whereby the load is 0.19-3.2 N when a 1-mm thickness thereof is 25% compressed by a columnar probe in which the distal end thereof forms a bottom surface having a diameter of 10 mm. The present invention is also a sealing material obtained by photocuring the sealing material composition.
Inventors:
AIZAWA HITOMI (JP)
Application Number:
PCT/JP2017/018122
Publication Date:
January 11, 2018
Filing Date:
May 12, 2017
Export Citation:
Assignee:
POLYMATECH JAPAN CO LTD (JP)
International Classes:
C08L63/00; C08F2/44; C08L25/04; H01L23/29; H01L23/31; H05K3/28
Foreign References:
| JPH03208221A | 1991-09-11 | |||
| JP2012087292A | 2012-05-10 | |||
| CN102432729A | 2012-05-02 | |||
| JP2017126595A | 2017-07-20 |
Attorney, Agent or Firm:
OHTAKE Seigo (JP)
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