Title:
SEALING MATERIAL AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/166657
Kind Code:
A1
Abstract:
The problem to be addressed by the present invention is to provide a sealing material which exhibits low moisture permeability and which can be formed into a sealing layer having a suitably low elastic modulus or a thin sealing layer. In order to solve this problem, the invention of the present application provides a sealing material that contains the following: a polymerizable monomer (B) which has at least one radical polymerizable group per molecule, has a molecular weight of 50-1000, and is a liquid at 23ºC; an acid anhydride derivative (C) which contains at least one 5-membered or 6-membered ring-forming acid anhydride group and at least one radical polymerizable functional group per molecule; and a radical polymerization initiator (D) which contains at least one of a thermal radical polymerization initiator and a photoradical polymerization initiator.
Inventors:
OKABE JUN
YAMAMOTO YUGO
TOMITA YUSUKE
YAMAMOTO YUGO
TOMITA YUSUKE
Application Number:
PCT/JP2015/002259
Publication Date:
November 05, 2015
Filing Date:
April 27, 2015
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C09K3/10; H01L51/50; H05B33/04
Domestic Patent References:
| WO2013144755A1 | 2013-10-03 |
Foreign References:
| JP2014044943A | 2014-03-13 | |||
| JP2002037822A | 2002-02-06 | |||
| JP2001131532A | 2001-05-15 |
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
Koichi Washida (JP)
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