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Title:
SEALING MATERIAL OF NEAR-INFRARED RAY IRRADIATION TYPE AND USE THEREOF, AND METHOD FOR ADHERING MEMBER
Document Type and Number:
WIPO Patent Application WO/2014/119565
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a sealing material of a near-infrared ray irradiation type, which can adhere a member composed of a resin, a glass or the like satisfactorily upon the irradiation with near-infrared ray using a laser; an adhesion product produced using the sealing material; and a method for adhering a member. The sealing material of a near-infrared ray irradiation type according to the present invention comprises: a near-infrared ray absorbent comprising at least a phosphonic acid copper salt represented by general formula (1); and at least one component selected from the group consisting of resins and compounds each capable of being polymerized into a polymer. In the formula, R1 represents a monovalent group represented by -CH2CH2-R11; and R11 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or a fluorinated alkyl group having 1 to 20 carbon atoms.

Inventors:
KATOHNO MASATAKA (JP)
MACHIDA KATSUICHI (JP)
Application Number:
PCT/JP2014/051827
Publication Date:
August 07, 2014
Filing Date:
January 28, 2014
Export Citation:
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Assignee:
KUREHA CORP (JP)
International Classes:
C09K3/10; C09J4/00; C09J5/06; C09J11/06; C09J123/00; C09J129/14; C09J131/04; C09J163/00; C09J183/04; C09J201/00; C09K3/00
Foreign References:
JP2006021524A2006-01-26
JP2012201865A2012-10-22
JP2012185385A2012-09-27
JP2004521974A2004-07-22
JPH0995649A1997-04-08
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
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