Title:
SEALING MATERIAL FOR SOLAR CELL MODULES, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/152314
Kind Code:
A1
Abstract:
Disclosed are a sealing material for solar cell modules and a manufacturing method thereof capable of endowing good transparency and heat resistance to the sealing material for solar cell modules while using a polyethylene resin. The disclosed sealing material for solar cell modules uses a polyethylene resin with a density of 0.900g/cm3 or less, and an MFR between 0.1g/10min and 1.0g/10min. The sealing material is obtained by melt molding a resin composition containing a polyethylene resin with density 0.890g/cm3 or less, and a polymerization initiator contained at 0.02 mass% or more but less than 0.5 mass% of the composition, wherein the density difference of the resin composition before and after the melt molding is within 0.05g/cm3, and the MFR difference of the resin composition before and after the melt molding is 1.0g/10min or greater.
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Inventors:
MURASAWA, Ken (1-1-1, Ichigaya Kagacho, Shinjuku-k, Tokyo 01, 〒1628001, JP)
村澤 憲 (〒01 東京都新宿区市谷加賀町一丁目1番1号 大日本印刷株式会社内 Tokyo, 〒1628001, JP)
村澤 憲 (〒01 東京都新宿区市谷加賀町一丁目1番1号 大日本印刷株式会社内 Tokyo, 〒1628001, JP)
Application Number:
JP2011/062244
Publication Date:
December 08, 2011
Filing Date:
May 27, 2011
Export Citation:
Assignee:
DAI NIPPON PRINTING CO., LTD. (1-1-1, Ichigaya Kagacho Shinjuku-k, Tokyo 01, 〒1628001, JP)
大日本印刷株式会社 (〒01 東京都新宿区市谷加賀町一丁目1番1号 Tokyo, 〒1628001, JP)
MURASAWA, Ken (1-1-1, Ichigaya Kagacho, Shinjuku-k, Tokyo 01, 〒1628001, JP)
大日本印刷株式会社 (〒01 東京都新宿区市谷加賀町一丁目1番1号 Tokyo, 〒1628001, JP)
MURASAWA, Ken (1-1-1, Ichigaya Kagacho, Shinjuku-k, Tokyo 01, 〒1628001, JP)
International Classes:
H01L31/042; B32B27/32; C09K3/10
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (Sapia Tower, 1-7-12 Marunouchi, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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Claims:
