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Patent Searching and Data


Title:
SEALING METHOD
Document Type and Number:
WIPO Patent Application WO/2004/003409
Kind Code:
A1
Abstract:
A sealing method for a fastening structure where two members are fastened together, a sealing method for a fixing structure where an article is fixed to a fixing member, and a sealing method facilitates sealing. In a sealing method for a fastening structure, a through hole (11a) is formed in a bracket (11) to fix the bracket to a body (10). A bolt (2) is inserted in the through hole (11a), and one end of the bolt (2) passed through the through hole (11a) is fixed to the body (10) side. The sealing method is formed from an expansible material and has a first step where a non-expansion body (non-foam body (4)) in a non-expansion state is installed in a fastening structure (1). The method has a second step where an expansion body (foam body (41)) is formed by expanding the non-expansion body (4) and the through hole (11a) is sealed by the expansion body (41).

Inventors:
MIZUTA SHINSUKE (JP)
TSUZUKI CHIHIRO (JP)
Application Number:
PCT/JP2003/008254
Publication Date:
January 08, 2004
Filing Date:
June 27, 2003
Export Citation:
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Assignee:
KYOWA SANGYO CO LTD (JP)
T I M ENTPR (JP)
MIZUTA SHINSUKE (JP)
TSUZUKI CHIHIRO (JP)
International Classes:
F16J15/10; F16B43/00; F16J15/14; F16B5/02; (IPC1-7): F16J15/06; F16F15/14
Foreign References:
JPS60101361A1985-06-05
JPH06241220A1994-08-30
JPH04101040U1992-09-01
JPH03118142A1991-05-20
JPS5622012A1981-03-02
Attorney, Agent or Firm:
Okada, Hidehiko c/o Nagoya, Chamber Of Commerce (& Industry Building 10-19, Sakae 2-chome, Naka-k, Nagoya-shi Aichi, JP)
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