Title:
SEALING PACKAGE OF SEMICONDUCTOR CHIP AND PROCESSING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/115929
Kind Code:
A1
Abstract:
The present invention relates to a sealed package of a semiconductor chip and a processing method therefor and, more particularly, to a sealed package of a semiconductor chip and a processing method for manufacturing the same by placing a semiconductor chip that must be sealed from the outside on a lower wire substrate chip in which a metal wire for transmitting a signal is included, and sealing the semiconductor chip by soldering a metal sealing part formed at a predetermined position of the lower wire substrate chip and an upper cover substrate functioning as a cover.
More Like This:
| WO/2003/067645 | SEMICONDUCTOR DEVICE AND METHOD OF ISOLATING CIRCUIT REGIONS |
| JP3268548 | ELECTRIC ASSEMBLY |
Inventors:
KWON MYUNG HO (KR)
LEE HO JUN (KR)
CHUNG HAN (KR)
LEE HO JUN (KR)
CHUNG HAN (KR)
Application Number:
PCT/KR2013/003399
Publication Date:
July 31, 2014
Filing Date:
April 22, 2013
Export Citation:
Assignee:
I3SYSTEM INC (KR)
International Classes:
H01L23/48
Foreign References:
| KR20110132219A | 2011-12-07 | |||
| KR20060045888A | 2006-05-17 | |||
| KR100818546B1 | 2008-04-01 | |||
| JPH05211254A | 1993-08-20 | |||
| JPH08274207A | 1996-10-18 |
Attorney, Agent or Firm:
BYUN, Chang Kyu et al. (KR)
변창규 (KR)
변창규 (KR)
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