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Title:
SEALING RESIN COMPOSITION, LAMINATE SHEET, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/163861
Kind Code:
A1
Abstract:
Provided is a sealing resin composition capable of suppressing the generation of voids in a gap between a substrate and a semiconductor chip mounted on the substrate, even when sealing the gap between the substrate and the semiconductor chip by means of heating and ultrasonic vibration. The sealing resin composition is for sealing a gap between a substrate 2 and a semiconductor chip 3 mounted on the substrate 2. The reaction starting temperature of the sealing resin composition is 160°C or less. The melt viscosity of the sealing resin composition is 200 Pa·s or less at the reaction starting temperature, 400 Pa·s or less between the reaction starting temperature and a temperature 40°C lower than the reaction starting temperature, and 1000 Pa·s or less at a temperature 50°C lower than the reaction starting temperature.

Inventors:
YAMATSU, Shigeru
WATANABE, Kazuki
KANAGAWA, Naoki
Application Number:
JP2019/006432
Publication Date:
August 29, 2019
Filing Date:
February 21, 2019
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
H01L23/29; C08F290/06; H01L21/60; H01L21/607; H01L23/31
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (Umeda Square Bldg, 12-17 Umeda 1-chome, Kita-ku, Osaka-sh, Osaka 01, 〒5300001, JP)
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