Title:
SEALING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/035430
Kind Code:
A1
Abstract:
This sealing resin composition includes an epoxy resin and an inorganic filler material. The dielectric relaxation value of the sealing resin composition in a cured state is 20 or lower when measured at a frequency of 0.001 Hz.
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Inventors:
MIZUSHIMA AYA (JP)
NAKADA TAKAHIRO (JP)
YUGUCHI KEITA (JP)
NAKADA TAKAHIRO (JP)
YUGUCHI KEITA (JP)
Application Number:
PCT/JP2018/030139
Publication Date:
February 21, 2019
Filing Date:
August 10, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08K3/36; H01L21/56; H01L23/29; H01L23/31; H01L25/07; H01L25/18
Foreign References:
| JP2012107209A | 2012-06-07 |
Other References:
SMAOUI H. ET AL.: "Study of dielectric relaxations in zinc oxide-epoxy resin nanocomposites", JOURNAL OF ALLOYS AND COMPOUNDS, vol. 477, pages 316 - 321, XP026086161, ISSN: 0925-8388, DOI: doi:10.1016/j.jallcom.2008.10.084
WU S. ET AL.: "Studies of Mineral-Filled Epoxy", POLYMER COMPOSITES, vol. 16, no. 3, 1995, pages 233 - 239, XP055575440, ISSN: 0272-8397
WU S. ET AL.: "Studies of Mineral-Filled Epoxy", POLYMER COMPOSITES, vol. 16, no. 3, 1995, pages 233 - 239, XP055575440, ISSN: 0272-8397
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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