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Title:
SEALING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/225471
Kind Code:
A1
Abstract:
Provided is an electrical/electronic sealing resin composition which exhibits long-term durability, in particular, long-term reliability with no physical deterioration under high-temperature and high-humidity conditions or high-temperature conditions. The sealing resin composition contains a polyester resin (A), carbodiimide (B), and an antioxidant (C).

Inventors:
MURAKAMI, Yuki (LTD. 1-1 Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
Application Number:
JP2018/019048
Publication Date:
December 13, 2018
Filing Date:
May 17, 2018
Export Citation:
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Assignee:
TOYOBO CO., LTD. (2-8 Dojima Hama 2-chome, Kita-ku Osaka-sh, Osaka 30, 〒5308230, JP)
International Classes:
C08L67/00; C08K5/29; C08L23/04; C08L61/06; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2012115065A12012-08-30
WO2015194584A12015-12-23
WO2015194583A12015-12-23
Foreign References:
JP2015224258A2015-12-14
JP2004262969A2004-09-24
JPH1158604A1999-03-02
JP2000052489A2000-02-22
JP2012184373A2012-09-27
JP2016000814A2016-01-07
JP2007119645A2007-05-17
JP2016065252A2016-04-28
JP2015147838A2015-08-20
JPH09278933A1997-10-28
JP2002037983A2002-02-06
JPH1025333A1998-01-27
JPS6369255A1988-03-29
JPS62112652A1987-05-23
JPS6274955A1987-04-06
JPH05117627A1993-05-14
JP2005082642A2005-03-31
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