Title:
SEALING RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2016/181761
Kind Code:
A1
Abstract:
Provided is a sealing resin sheet that having satisfactory fillability and re-peelability. The present invention pertains to a sealing resin sheet in which the tack at 25°C is 150 g or less and the minimum melt viscosity over a temperature range of 50-150°C is 50 Pa•s or less. The sealing resin sheet preferably contains an inorganic filler having an average grain diameter of 0.1-10 μm. The sealing resin sheet preferably has an inorganic filler content of 65-85% by weight relative to the weight of the total solids content of the sealing resin sheet.
Inventors:
IINO CHIE (JP)
SHIGA GOJI (JP)
SHIGA GOJI (JP)
Application Number:
PCT/JP2016/062192
Publication Date:
November 17, 2016
Filing Date:
April 18, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/29; C08G59/24; H01L23/12; H01L23/31; H05K3/28; H05K3/46
Foreign References:
| JP2014029958A | 2014-02-13 | |||
| JP2014131016A | 2014-07-10 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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