Title:
SEALING RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2021/010205
Kind Code:
A1
Abstract:
In this sealing resin sheet, the 85°C viscosity (v0.01) at a shear rate of 0.01 rad/s is at least 8×105 Pa⋅s, and the 85°C viscosity (ν0.1) at a shear rate of 0.1 rad/s is less than 8×105 Pa⋅s.
Inventors:
SHIMIZU YUUSAKU (JP)
HABU TAKASHI (JP)
HAMANA DAIKI (JP)
HABU TAKASHI (JP)
HAMANA DAIKI (JP)
Application Number:
PCT/JP2020/026413
Publication Date:
January 21, 2021
Filing Date:
July 06, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/29; C08J5/18; C08K3/013; C08K3/34; C08K7/00; C08K9/04; C08L101/00; H01L21/56; H01L23/31
Foreign References:
| JP2005133055A | 2005-05-26 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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