Title:
SEALING SHEET AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/159619
Kind Code:
A1
Abstract:
In a semiconductor-device manufacturing method including a treatment step in which an alkaline solution is used, the present invention provides a sealing sheet 1 that is used for sealing a semiconductor chip incorporated in a substrate or sealing a semiconductor chip on an adhesive sheet. The sealing sheet 1 is provided with at least a curable adhesive layer 11, and the adhesive layer 11 is formed from an adhesive composition containing a thermosetting resin, a thermoplastic resin, and an inorganic filler surface-treated with a surface treatment agent having a minimum coating area of less than 550 m2/g. With the sealing sheet 1, swelling of metal plating is less likely to occur.
More Like This:
Inventors:
WATANABE YASUTAKA (JP)
NEZU YUSUKE (JP)
SUGINO TAKASHI (JP)
NEZU YUSUKE (JP)
SUGINO TAKASHI (JP)
Application Number:
PCT/JP2018/007288
Publication Date:
September 07, 2018
Filing Date:
February 27, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L23/29; C09C1/28; C09C1/40; C09C3/12; C09J11/04; C09J11/06; C09J201/00; H01L21/56; H01L23/31
Foreign References:
| JP2016103625A | 2016-06-02 | |||
| JP2012059743A | 2012-03-22 | |||
| JP2013251368A | 2013-12-12 | |||
| JP2016213321A | 2016-12-15 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF: