Title:
SEALING SHEET, AND SEALING STRUCTURE AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/146935
Kind Code:
A1
Abstract:
Provided is a sealing sheet having a resin layer comprising a resin portion (A) formed by a resin composition including at least one resin selected from acrylic-based resins and urethane-based resins, and a resin portion (B) having a water vapor permeability measured in accordance with JIS K 7129 of 15 g/m2/day or less, wherein the resin portion (A) and the resin portion (B) are present on at least one surface of the resin layer. The sealing sheet itself exhibits a superior moisture permeation suppression effect, and when a sealing structure is produced, a superior effect of preventing moisture penetration into the sealing structure from between a substrate (adherend) and the sealing sheet is achieved.
Inventors:
KAWADA SATOSHI (JP)
MATSUSHIMA MASARU (JP)
MATSUSHIMA MASARU (JP)
Application Number:
PCT/JP2015/058793
Publication Date:
October 01, 2015
Filing Date:
March 23, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09K3/10; B32B27/30; B32B27/40; H01L31/048; H01L51/50; H05B33/04
Domestic Patent References:
| WO2010119706A1 | 2010-10-21 |
Foreign References:
| JPH0222376A | 1990-01-25 |
Other References:
See also references of EP 3124568A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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