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Patent Searching and Data


Title:
SEALING SHEET
Document Type and Number:
WIPO Patent Application WO/2022/130447
Kind Code:
A1
Abstract:
The present invention is a sealing sheet that has a curable sealant layer. The sealing sheet is characterized by satisfying conditions (I), (II), and (III). Condition (I): The sealant layer contains a phenoxy resin that has a glass transition temperature (Tg) of at least 90°C. Condition (II): The sealant layer contains one or more type of compound that has an alicyclic skeleton and a cyclic ether group. Condition (III): The product of curing the sealant layer has a dielectric constant of no more than 3.5 at 23°C and a frequency of 100 kHz. The present invention thereby provides a sealing sheet that has a sealant layer that forms a cured product that has low dielectric characteristics and excellent transparence.

Inventors:
NISHIJIMA KENTA (JP)
Application Number:
PCT/JP2020/046517
Publication Date:
June 23, 2022
Filing Date:
December 14, 2020
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H05B33/04; H01L51/50
Domestic Patent References:
WO2018235824A12018-12-27
WO2019065455A12019-04-04
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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