Title:
SEALING STRUCTURE, SEALING METHOD, SENSOR AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/048609
Kind Code:
A1
Abstract:
Disclosed by the present application is a sealing structure, a sealing method, a sensor and an electronic device. The sealing structure is used for a chip, and the sealing structure comprises: a substrate, a housing, a light-blocking adhesive and a light-reflective adhesive, and one surface of the substrate is used for the placement of the chip; the housing encases the chip, one end of the housing is connected to the substrate, and the end of the housing that faces away from the substrate is provided with a sealing opening; the light-blocking adhesive is provided on the side of the chip facing away from the substrate, and covers the chip; and the light-reflective adhesive is provided at the side of the light-blocking adhesive facing away from the substrate. The technical solution of the present application can improve the accuracy of sensor measurement.
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Inventors:
WANG CHAO (CN)
LI XIANGGUANG (CN)
FANG HUABIN (CN)
FU BO (CN)
LI XIANGGUANG (CN)
FANG HUABIN (CN)
FU BO (CN)
Application Number:
PCT/CN2021/116317
Publication Date:
March 10, 2022
Filing Date:
September 02, 2021
Export Citation:
Assignee:
WEIFANGGOERTEK MICROELECTRONICS CO LTD (CN)
International Classes:
H05K5/06
Foreign References:
| CN111935939A | 2020-11-13 | |||
| CN210927971U | 2020-07-03 | |||
| CN105006510A | 2015-10-28 | |||
| CN210325851U | 2020-04-14 | |||
| US20170081175A1 | 2017-03-23 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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