SEALING STRUCTURE AND SEALING METHOD OF THROUGH HOLE, AND TRANSFER SUBSTRATE FOR SEALING THROUGH HOLE

WIPO Patent Application WO/2018/190226

A1

The present invention relates to a sealing structure which is composed of a pair of substrates that form a sealed space, a through hole that is in communication with the sealed space, and a sealing member that seals the through hole. A base metal film that is formed of a bulk metal such as gold is formed on the surface of a substrate in which the through hole is formed; and the sealing member is bonded to the base metal film, thereby sealing the through hole. This sealing member is composed of: a sealing material which is formed of a compressed body of a metal powder that is formed from a gold having a purity of 99.9% by mass or more, and which is bonded to the base metal film; and a cover-like metal film which is formed of a bulk metal that contains gold and has a thickness of from 0.01 μm to 5 μm (inclusive). The sealing material is composed of an outer peripheral densification region which is in contact with the base metal film and a central porous region which is in contact with the through hole. In addition, the shapes of pores within the densification region are defined so that the horizontal length (l) of a pore in a radial direction and the width (W) of the densification region satisfy the relational expression l ≤ 0.1W.

OGASHIWA TOSHINORI (JP)
SASAKI YUYA (JP)
MIYAIRI MASAYUKI (JP)
INOUE KENICHI (JP)

PCT/JP2018/014446

October 18, 2018

April 04, 2018

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TANAKA PRECIOUS METAL IND (JP)

H01L23/02; B22F3/24; B22F7/04; B81C3/00

JP2013211358A	2013-10-10
JP2008028364A	2008-02-07
JP2017195291A	2017-10-26
JP2007165494A	2007-06-28
JP5065718B2	2012-11-07

See also references of EP 3611759A4

TANAKA AND OKAZAKI (JP)

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