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Title:
SEALING THERMOSETTING-RESIN SHEET AND HOLLOW-PACKAGE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/079887
Kind Code:
A1
Abstract:
This invention provides a sealing thermosetting-resin sheet and a hollow-package manufacturing method whereby it is difficult for the material constituting said sealing thermosetting-resin sheet to flow into gaps between an adherend and an electronic device. This invention pertains to a sealing thermosetting-resin sheet that is used to manufacture a hollow package. When cured, said sealing thermosetting-resin sheet has a domain-matrix structure comprising a matrix part consisting primarily of a first resin component and domain parts consisting primarily of a second resin component, with the matrix part being softer than the domain parts.

Inventors:
TOYODA EIJI (JP)
HABU TAKASHI (JP)
ICHIKAWA TOMOAKI (JP)
SHIMIZU YUSAKU (JP)
Application Number:
PCT/JP2014/079535
Publication Date:
June 04, 2015
Filing Date:
November 07, 2014
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/08; H01L21/60; H01L23/29; H01L23/31; H03H3/08; H03H9/25
Domestic Patent References:
WO2014013697A12014-01-23
Foreign References:
JP2003017979A2003-01-17
JPH08120054A1996-05-14
JPH1050899A1998-02-20
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
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