Title:
SEAMLESS-CAN MANUFACTURING DEVICE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/079935
Kind Code:
A1
Abstract:
The present invention pertains to a manufacturing device and a manufacturing method which are for manufacturing a seamless can by drawing and ironing, or the like, using a resin-coated metal plate obtained by forming a resin coating on an inner surface and/or an outer surface of said plate. Provided are: a seamless can manufacturing device comprising a partial heating means which is capable of suppressing formation of scratches in a neck section of a resin-coated seamless can or peeling of a resin coating; and a method for manufacturing a seamless can by using said manufacturing device.
Inventors:
ISHIGURO HIDEKI (JP)
NAKAMURA MASAYUKI (JP)
WAKISAKA KOUJI (JP)
KANAZAWA SEITARO (JP)
UCHINO SHOTA (JP)
NAKAMURA MASAYUKI (JP)
WAKISAKA KOUJI (JP)
KANAZAWA SEITARO (JP)
UCHINO SHOTA (JP)
Application Number:
PCT/JP2022/038537
Publication Date:
May 11, 2023
Filing Date:
October 17, 2022
Export Citation:
Assignee:
TOYO SEIKAN CO LTD (JP)
International Classes:
B21D51/26; B21D22/28; B65D1/00
Foreign References:
| JP2004148324A | 2004-05-27 | |||
| JP2007296565A | 2007-11-15 | |||
| JP2013099761A | 2013-05-23 | |||
| JPH09278038A | 1997-10-28 | |||
| JP2013107093A | 2013-06-06 | |||
| JPH08117903A | 1996-05-14 | |||
| JPH0919733A | 1997-01-21 |
Attorney, Agent or Firm:
ATAGO IP (JP)
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