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Patent Searching and Data


Title:
SECURITY CHIP
Document Type and Number:
WIPO Patent Application WO/2019/153395
Kind Code:
A1
Abstract:
Disclosed is a security chip, comprising at least one first internal circuit module and a first interconnect redefining module adjacently connected to the first internal circuit module. The first interconnect redefining module is configured to map, according to a configuration file of the first interconnect redefining module, an original signal line of the first internal circuit module to a physical metal wire port provided by the first interconnect redefining module. The security chip of the present invention has a high security level and can prevent multiple types of cracks and attacks.

Inventors:
WANG LIANGQING (CN)
LI YAMING (CN)
XIANG BINGYU (CN)
Application Number:
CN2018/077996
Publication Date:
August 15, 2019
Filing Date:
March 05, 2018
Export Citation:
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Assignee:
SHENZHEN STATE MICRO TECH CO (518000, CN)
International Classes:
G06F21/76; G06F13/38; G06F21/72
Foreign References:
CN105468294A2016-04-06
CN103745050A2014-04-23
US20130125204A12013-05-16
Attorney, Agent or Firm:
SHENZHEN KANGHONG INTELLECTUAL PROPERTY AGENT CO., LTD. (518026, CN)
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