Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SECURITY CHIP
Document Type and Number:
WIPO Patent Application WO/2019/153395
Kind Code:
A1
Abstract:
Disclosed is a security chip, comprising at least one first internal circuit module and a first interconnect redefining module adjacently connected to the first internal circuit module. The first interconnect redefining module is configured to map, according to a configuration file of the first interconnect redefining module, an original signal line of the first internal circuit module to a physical metal wire port provided by the first interconnect redefining module. The security chip of the present invention has a high security level and can prevent multiple types of cracks and attacks.

Inventors:
WANG, Liangqing (SSMEC Building 2F, Gao Xin Nan First Avenue High-Tech Park South, Nansha, Shenzhen Guangdong 0, 518000, CN)
LI, Yaming (SSMEC Building 2F, Gao Xin Nan First Avenue, High-Tech Park South, Nansha, Shenzhen Guangdong 0, 518000, CN)
XIANG, Bingyu (SSMEC Building 2F, Gao Xin Nan First Avenue High-Tech Park South, Nansha, Shenzhen Guangdong 0, 518000, CN)
Application Number:
CN2018/077996
Publication Date:
August 15, 2019
Filing Date:
March 05, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHENZHEN STATE MICRO TECHNOLOGY CO., LTD. (SSMEC Building 2F, Gao Xin Nan First Avenue High-Tech Park South, Nansha, Shenzhen Guangdong 0, 518000, CN)
International Classes:
G06F21/76; G06F13/38; G06F21/72
Attorney, Agent or Firm:
SHENZHEN KANGHONG INTELLECTUAL PROPERTY AGENT CO., LTD. (6C1 Building A, ZhongYin BuildingNO.5015, CaiTian Rd., Futian Distric, Shenzhen Guangdong 6, 518026, CN)
Download PDF: