MANUFACTURING AND USING THE SAME

CROSS REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of U.S. Provisional Pat. Appl. No.

62/475,519, filed on March 23, 2017, incorporated herein by reference as if fully set forth herein.

FIELD OF THE INVENTION

[0002] The present invention generally relates to the field(s) of product security and authentication. More specifically, embodiments of the present invention pertain to an electronic security tag or device (which may communicate wirelessly) that can detect a continuity state of a package or container (e.g., whether the package or container is opened or closed) using capacitive coupling, and methods of manufacturing and using the same.

DISCUSSION OF THE BACKGROUND

[0003] Wireless communication tags, such as the OpenSense security tags commercially available from Thin Film Electronics ASA, include labels with electronics printed or otherwise formed thereon that detect whether a package or container has been opened and communicate the continuity state using NFC (near field communication) or RF (radio frequency) protocols. However, it can be challenging to tailor a different wireless communication tag for each different type, shape and size of package or container. Furthermore, some current solutions protect only one interface for opening the package or container (e.g., the interface between a bottle and a cap), which is insufficient for many applications, such as packages or containers with more than one interface between separable parts (e.g., a box with separable flaps on the top and bottom).

[0004] Printing items such as artwork or text on containers such as cartons has been long known. However, high-speed printing of electrical structures such as wires, antennas and sensors on packaging such as cartons has only relatively recently become possible. A disadvantage of printed sensing lines on a package such as a carton is the risk of electrostatic discharge (ESD) from a user of the package or container, since the sensing lines may be exposed. For example, ESD may be conducted from the user to an integrated circuit (IC) on the wireless communication tag when a user touches an exposed sensing line. ESD may damage the electrical components on the tag (e.g., the IC and/or the memory). Another disadvantage of such sensing lines is the inability to repeatedly detect the opening and closing of the package or container. Once the sensing lines are broken, they cannot detect that the container has been closed.

[0005] This "Discussion of the Background" section is provided for background information only. The statements in this "Discussion of the Background" are not an admission that the subject matter disclosed in this "Discussion of the Background" section constitutes prior art to the present disclosure, and no part of this "Discussion of the Background" section may be used as an admission that any part of this application, including this "Discussion of the Background" section, constitutes prior art to the present disclosure.

SUMMARY OF THE INVENTION

[0006] The present invention generally relates to the field(s) of product security and authentication. More specifically, the present invention relates to a security device (e.g., a wireless or battery-operated security device) that senses a continuity state of a package or container by capacitive coupling, and methods of manufacturing and using such a device.

[0007] The security device may communicate wirelessly (e.g., using an antenna), or alternatively, may include a battery and a display. The security device generally comprises a first substrate configured to be applied, affixed or attached to a first part of a package or container, a continuity sensor on the first substrate configured to determine a continuity state of the package or container, and at least one main capacitor electrode on the first substrate electrically connected to the continuity sensor and configured to capacitively couple to at least one complementary capacitor electrode on the second part of the package or container. The first and second parts of the package or container may be separable from or moveable relative to each other, and/or may have an interface between them. The main capacitor electrode(s) on the first substrate and the complementary capacitor electrode(s) on the second part of the package or container form a capacitor that has a first capacitance when the package or container is closed and a second capacitance when the package or container is open. The security device also includes a component selected from an antenna and a battery, either on the first substrate or on a second substrate. The antenna is configured to receive a first wireless signal and optionally transmit or broadcast a second wireless signal, and in the absence of the battery, enable the integrated circuit to extract power from the first wireless signal. The battery is configured to provide power to the continuity sensor.

[0008] In various embodiments, the continuity sensor may generate a first digital value representing the continuity state of the package or container when it detects the first capacitance and/or a second digital value representing the continuity state of the package or container when it detects the second capacitance. The first capacitance may be greater than or equal to a first predetermined threshold, and the second capacitance may be less than a second predetermined threshold. The second predetermined threshold is less than the first predetermined threshold. In some examples, the first capacitance has a non-zero value, and the second capacitance is zero or substantially zero.

[0009] In one or more embodiments, the main capacitor electrode(s) on the first substrate may comprise a first segment that is aligned with and parallel to an edge of the first substrate and a second segment that electrically connects the continuity sensor and the first segment. In other or further embodiments, the complementary capacitor electrode(s) may comprise a third segment that is aligned with and parallel to an edge of the first substrate, and optionally, a fourth segment that electrically connects the continuity sensor and the third segment.

[0010] In some embodiments, the security device may comprise a plurality of main capacitor electrodes (at least one of which is on the first substrate), configured to capacitively couple to a plurality of complementary capacitor electrodes (at least one of which is on the second part of the package or container). In other or further embodiments, the security device includes an integrated circuit (IC) on the first substrate, and the IC includes the continuity sensor. The integrated circuit may comprise a memory that includes one or more bits (e.g., a first plurality of bits) configured to store the first or second value, and/or one or more bits (e.g., a second plurality of bits) configured to store a unique identification number for the security device.

[0011] In various embodiments, the security device comprises the antenna, and the antenna may be on the first substrate. A strap may electrically connect an inner end of the antenna to a location on the first substrate external to the antenna. Alternatively, the antenna may be on the second substrate. In other or further embodiments, the antenna may include a set of connection pads, the integrated circuit may include first and second bond pads or bumps configured to be electrically connected to the set of connection pads, and the integrated circuit may function as a strap connecting inner and outer ends of the antenna. In such embodiments, the antenna may consist of a single metal layer. The antenna may be configured to receive and/or transmit near field and/or radio frequency signals.

[0012] In other embodiments, the security device may comprise the battery, and optionally, a display. The battery and display may independently be on the first substrate or the second substrate, and when one is on the second substrate, the other may be on a third substrate. For example, the battery and the display may be on a common substrate. The display may be electrically connected to the battery and the memory through the integrated circuit. In further embodiments, the memory is configured to provide the continuity state data and/or instructions to the display.

[0013] In some embodiments, an adhesive may be on the first substrate. The adhesive may be on the same side of the substrate as the continuity sensor and the main capacitor electrode(s), or on an opposite side of the substrate from the continuity sensor and the main capacitor electrode(s). The adhesive may be used to adhere the security device to the package or container, and may further include a peelable protective film or layer on a surface of the adhesive opposite from the substrate, the continuity sensor and the main capacitor electrode(s).

[0014] In various embodiments, the continuity sensor, the main capacitor electrode(s) and/or the integrated circuit may comprise (i) one or more printed layers and/or (ii) one or more thin films. For example, the integrated circuit may comprise a plurality of printed layers and/or a plurality of thin films. In some embodiments, each of the substrate(s) may independently comprise a plastic film or sheet or a metal foil. For example, the substrate may be flexible, electrically insulating or insulated, and/or able to withstand a processing temperature of up to 200 °C.

[0015] In another aspect, the invention relates to a package or container that may comprise first and second separable or relatively moveable parts that form an interface, a substrate having a continuity sensor thereon configured to determine a continuity state of the package or container, at least one main capacitor electrode on the first part of the package or container or on the substrate and electrically connected to the continuity sensor, at least one complementary capacitor electrode on the second part of the package or container, and an antenna or a battery on the first substrate or a second substrate. The antenna is configured to (i) receive a first wireless signal and optionally transmit or broadcast a second wireless signal and (ii) in the absence of the battery, enable the integrated circuit to extract power from the first wireless signal. The battery is configured to provide power to the continuity sensor. A capacitor including the main capacitor electrode(s) and the complementary capacitor electrode(s) has a first capacitance when the package or container is closed and a second capacitance when the package or container is open. In various embodiments, the package or container may comprise ajar, a clamshell container, a box, an envelope, or a tray (e.g., with a sliding lid).

[0016] In some embodiments, the main capacitor electrode(s) may be capacitively coupled to the complementary capacitor electrode(s) when the package or container is closed. In further or other embodiments, the main capacitor electrode(s) are on the first substrate, and the first substrate may be proximate to the interface of the first and second separable or relatively moveable parts. For example, an edge of the first substrate may be parallel with or perpendicular to an edge of the interface. In some designs, the main capacitor electrode(s) comprise (i) a first segment that is aligned with and parallel to the edge of the first substrate and (ii) a second segment that electrically connects the continuity sensor and the first segment. In additional or alternative embodiments, the complementary capacitor electrode(s) comprise a third segment that is aligned with and parallel to the edge of the interface, and optionally, a fourth segment that electrically connects the continuity sensor and the third segment.

[0017] In various embodiments, the main capacitor electrode is on the first substrate, and the first substrate further includes at least one trace electrically connected to (1) the continuity sensor and/or an integrated circuit (IC) including the continuity sensor and (2) at least one connection pad electrically connected to the trace and one of the main capacitor electrode(s), and/or at least one other trace electrically connected to the continuity sensor and/or IC and at least one other connection pad electrically connected to the other trace and the complementary capacitor electrode(s). In one embodiment, the connection pad(s) on the substrate is/are electrically connected to the continuity sensor.

[0018] In another aspect, the invention relates to a method of manufacturing a security device, comprising forming at least one main capacitor electrode on a first substrate, forming a continuity sensor on the first substrate configured to determine a continuity state of a package or container, and forming a component selected from an antenna and a battery on the first substrate or a second substrate. The antenna is configured to (i) receive a first wireless signal and optionally transmit or broadcast a second wireless signal and (ii) in the absence of the battery, enable the integrated circuit to extract power from the first wireless signal. The battery is configured to provide power to the continuity sensor. The continuity sensor is electrically connected to the main capacitor electrode. The first substrate is configured to be applied, affixed or attached to a first part of a package or container that is separable or moveable relative to a second part of the package or container. The main capacitor electrode(s) is/are configured to capacitively couple to at least one complementary capacitor electrode on the second part of the package or container, such that a capacitor including the main and complementary capacitor electrodes has a first (e.g., non-zero) capacitance when the package or container is closed and a second (e.g., zero) capacitance when the package or container is open.

[0019] In various embodiments, the continuity sensor is configured to generate a first digital value representing the continuity state of the package or container when it detects the first capacitance and/or a second digital value representing the continuity state of the package or container when it detects the second capacitance. The first capacitance may be greater than or equal to a first predetermined threshold, and the second capacitance may be less than a second predetermined threshold. The second predetermined threshold is less than the first predetermined threshold.

[0020] In some embodiments, forming the main capacitor electrode(s) may comprise printing a first segment that is aligned with and parallel to an edge of the first substrate, and printing a second segment that electrically connects the continuity sensor and the first segment. In other or further embodiments, forming the main capacitor electrode(s) on the first substrate and/or the complementary capacitor electrodes on the second part of the package or container comprises printing a plurality of main capacitor electrodes.

[0021] In some embodiments, the method of manufacturing a security device may comprise forming an integrated circuit on the first substrate. The integrated circuit may include the continuity sensor. Forming the integrated circuit may also comprise forming a memory that includes (i) one or more bits (e.g., a plurality of bits) configured to store the value of the continuity state and/or (ii) one or more bits (e.g., a plurality of bits) configured to store a unique identification number for the security device. In some embodiments, forming the memory comprises printing at least one layer of the memory.

[0022] In some embodiments, the method comprises forming the antenna. For example, the antenna may be formed on the first substrate (e.g., by printing and conductive ink in a predetermined pattern on the first substrate, and converting the conductive ink to a conductive material). In such embodiments, the method of manufacturing may further comprise electrically connecting a strap to an inner end of the antenna and to a trace on the first substrate external to the antenna, the trace being electrically connected (directly or indirectly) to the continuity sensor or integrated circuit. Alternatively, the antenna may be formed on a second substrate. In such an alternative embodiment, forming the antenna may include forming a set of connection pads at ends of the antenna, forming the integrated circuit (on the first substrate) may include forming first and second bond pads or bumps configured to be electrically connected to the set of connection pads, and the method may further comprise attaching or connecting the connection pads of the antenna to the bond pads or bumps of the integrated circuit. In such embodiments, the integrated circuit may function as a strap connecting inner and outer ends of the antenna. In the alternative embodiment, forming the antenna may consist of printing a single metal layer in a pattern corresponding to the antenna. The antenna may be configured to receive and/or transmit near field and/or radio frequency signals.

[0023] In other embodiments, forming the security device may comprise forming the battery. The battery may be formed on the first substrate or on a second substrate (or, if the security device further includes an antenna, on a third substrate), and the method may further comprise electrically connecting the battery to the integrated circuit. In such embodiments, the method of manufacturing may further comprise forming a display on the first substrate, the second substrate, a third substrate, or (if the security device further includes an antenna) a fourth substrate, and electrically connecting the display to the battery and optionally to the memory through the integrated circuit. In one embodiment, the battery and the display may be formed on a common substrate.

[0024] The method may further comprise applying an adhesive on the first substrate.

The adhesive may be applied to the same side of the substrate as the continuity sensor and the main capacitor electrode(s), or to an opposite side of the substrate from the continuity sensor and the main capacitor electrode(s). In such embodiments, the method may further comprise applying a peelable protective film or backing to the adhesive.

[0025] In embodiments including the integrated circuit, forming the integrated circuit may comprise (i) printing one or more layers of the integrated circuit and/or (ii) forming one or more thin films and patterning the thin film(s). For example, forming the integrated circuit may comprise printing a plurality of layers of the integrated circuit in corresponding predetermined patterns. Alternatively or additionally, forming the integrated circuit may comprise forming a plurality of thin films and patterning the thin films.

[0026] In another aspect, the invention relates to a method of detecting a continuity state of a package or container, comprising attaching a substrate with a security device thereon to a package or container having a first part and a second part that is separable from or moveable relative to the first part, determining a capacitance of a capacitor formed from at least one main capacitor electrode on the first part of the package or container or on the substrate and at least one complementary capacitor electrode on the second part of the package or container using a continuity sensor, comparing the capacitance with a first predetermined capacitance value corresponding to the continuity state of a closed package or container and/or a second predetermined capacitance value corresponding to the continuity state of an open package or container using the continuity sensor, determining the continuity state of the package or container from the comparison(s), and transmitting or displaying a value representing the continuity state of the package or container. The first predetermined capacitance value is generally greater than the second predetermined capacitance value.

[0027] In some embodiments, the main capacitor electrode(s) is/are on the first part of the package or container. In other embodiments, the main capacitor electrode(s) is/are on the substrate. In various embodiments, the main capacitor electrode(s) may comprise a plurality of main capacitor electrodes, and the complementary capacitor electrodes may comprise a plurality of complementary capacitor electrodes.

[0028] In some embodiments, the method further comprises connecting the continuity sensor to the antenna or display with an integrated circuit. In one embodiment, the method further comprises storing the value representing the continuity state of the package or container in a memory (which may be in an integrated circuit including the continuity sensor). In one embodiment, the method comprises transmitting the value of the continuity state using an antenna (which may be on the same or different substrate). In another embodiment, the method further comprises displaying the value of the continuity state (or a representation thereof) on a display, which may be on the same or different substrate.

[0029] The present invention advantageously enables sensing a continuity state of a package or container with one or more interfaces between separable or relatively moveable parts to reversibly sense the continuity state of the package or container, and without relying on tearing or breaking a sense line across the interface. The present invention expands the number and types of packages and containers for which continuity sensing can be performed. It also expands the functionality of continuity sensing (e.g., to use capacitive coupling and/or to include multiple occurrences of opening and closing a container). The present invention also avoids complexities encountered when trying to form a sense line across an interface of a package or container such as a corrugated box or a folding carton, and may reduce or avoid the disadvantage of sensing lines with regard to electrostatic discharge (ESD). The present invention minimizes or avoids risks of ESD when the capacitor electrodes are sealed or covered. These and other advantages of the present invention will become readily apparent from the detailed description of various embodiments below.

BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG. 1 is a schematic diagram showing a capacitive sensing device that determines and displays a continuity state of a package or container in accordance with one or more embodiments of the present invention.

[0031] FIG. 2 shows a diagram of an exemplary security device in accordance with one or more embodiments of the present invention.

[0032] FIGS. 3A-B show diagrams of an exemplary security device including an integrated circuit (IC) that functions as a strap for an antenna in accordance with one or more embodiments of the present invention, before and after affixing the IC to the antenna.

[0033] FIGS. 4A-B show an exemplary security device on an envelope, before and after tearing a strip to open the envelope, in accordance with an embodiment of the present invention. [0034] FIG. 5A shows an exemplary security device on a tray with a sliding lid, in accordance with an embodiment of the present invention.

[0035] FIG. 5B shows an alternative arrangement of the exemplary security device on an alternative tray with a sliding lid, in accordance with another embodiment of the present invention.

[0036] FIG. 5C shows an exemplary security device on a jar, in accordance with an embodiment of the present invention.

[0037] FIG. 5D shows an exemplary security device on a folding carton in accordance with one or more embodiments of the present invention.

[0038] FIG. 5E shows an exemplary security device on a corrugated box in accordance with one or more embodiments of the present invention.

[0039] FIGS. 6A-B show an exemplary design for an alternative security device on the corrugated box, before and after affixing the security device to the box.

[0040] FIG. 7 shows a diagram of an exemplary integrated circuit suitable for the present security device, in accordance with one or more embodiments of the present invention.

[0041] FIG. 8 is a flow chart of an exemplary method for making the present security device and detecting a continuity state of a package or container in accordance with one or more embodiments of the present invention.

DETAILED DESCRIPTION

[0042] Reference will now be made in detail to various embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the following embodiments, it will be understood that the descriptions are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents that may be included within the spirit and scope of the invention. Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be readily apparent to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to unnecessarily obscure aspects of the present invention. Furthermore, it should be understood that the possible permutations and combinations described herein are not meant to limit the invention. Specifically, variations that are not inconsistent may be mixed and matched as desired.

[0043] In addition, for convenience and simplicity, the terms "part," "portion,"

"section," and "region" may be used interchangeably, as are "package" and "container", but these terms are generally given their art-recognized meanings. Also, unless indicated otherwise from the context of its use herein, the terms "known," "fixed," "given," "certain" and "predetermined" generally refer to a value, quantity, parameter, constraint, condition, state, process, procedure, method, practice, or combination thereof that is, in theory, variable, but is typically set in advance and not varied thereafter when in use.

[0044] The present invention relates to an electronic security device with a sensor configured to detect an opened or tampered state of a package or container to which the device is attached. In one embodiment, the security device communicates wirelessly (e.g., with an NFC or RF reader). In other embodiments, the security device includes a display and a battery. The security device generally includes a continuity sensor (which may be part of an integrated circuit) on a substrate, and an antenna or display on the same or a different substrate. The continuity sensor is configured to be electrically connected to one or more main capacitor electrodes on the substrate or on a first part of the package or container, and the main capacitor electrode(s) are capacitively coupled to one or more complementary capacitor electrodes on one or more second parts of the package or container that are moveable relative to or separable from the first part. The antenna, when present, is configured to receive a first wireless signal (e.g., from a reader) and/or transmit or broadcast a second wireless signal (e.g., from the integrated circuit). The display, when present, is configured to display an indicator indicating the continuity state of the package or container. The integrated circuit, when present, may be configured to either (i) process the first wireless signal and/or information therefrom and generate the second wireless signal and/or information therefor when the device includes the antenna, or (ii) indicate the continuity state of the package or container using the display when the device includes the display. A receiver and/or transmitter may be included in the integrated circuit (e.g., when the security device includes the antenna). [0045] Thus, the security device is connected (capacitively or directly) to at least one capacitor electrode on the package or container. The capacitor electrodes are generally configured to sense a continuity state of the package or container on or in which the capacitor electrodes form a capacitor. The capacitor has a first capacitance when the package or container is closed, and a second capacitance when the package or container is open. For example, the first capacitance may be a non-zero value, and the second capacitance may be zero or substantially zero. When the security device forms two or more capacitors, an intermediate capacitance between the first and second capacitances may indicate a "partially open" state. In one embodiment, the security device includes connection pads that connect one or more of the capacitor electrodes to the continuity sensor.

[0046] In some embodiments, the present security device is a generic wireless security device with a generic antenna connected thereto, and a mechanism for connecting the generic wireless security device to one or more capacitor electrodes (functioning as a kind of sense line) on a separate substrate (e.g., the package or container). However, the invention is not so limited. Connecting the generic wireless security device to the capacitor electrode(s) is one of several possible arrangements of components that can be made more easily or efficiently on a separate substrate. Displays, additional sensors, batteries, and switches (e.g., to connect/disconnect the device to another component) can be connected in the same way (e.g., using a set of connection pads that can electrically connect to an integrated circuit on a separate substrate, directly or through one or more traces on the package or container).

[0047] In fact, the antenna may also be separately connectable to the integrated circuit (generally through a second set of connection pads different from the connection pad[s] to which the capacitor electrode[s] connect). However, in some embodiments, at least one of the separately connectable components (e.g., the antenna) is on the same substrate as the integrated circuit. The separately connectable component(s) may be electrically connected to the integrated circuit and/or antenna using any of a variety of different mechanisms (e.g., capacitive, inductive, and several different kinds of ohmic connections).

[0048] In any case, the present invention provides a fully secure wireless or display- based security solution for nearly any type or shape of package, container or carton. The solution does not require line of sight, so it does not interfere with any graphics on the package, container or carton. The present security device can assist with use cases such as return fraud, in-store tampering, and consumer protection. The present security device can also help with consumer engagement (e.g., to ensure that the consumer opens the package, container or carton correctly), and can provide different user experiences depending on whether the package or container is open or closed.

[0049] The present invention is also applicable to flexible packaging. Thus, in various embodiments, the antenna and/or the integrated circuit can be on a substrate that comprises paper, a glass/polymer laminate, a paper/polymer laminate, a high temperature polymer, a metal foil, or a combination thereof. When the substrate comprises the high temperature polymer, the high temperature polymer may comprise a polyimide, a polyethersulfone, a polyethylene terephthalate (PET), a polyethylene naphthalate (PEN), or a polyether ether ketone (PEEK). Alternatively, when the substrate comprises a metal foil, the metal foil may comprise aluminum, stainless steel or copper.

[0050] In summary, the present invention comprises a security device (e.g., an inlay and/or chip) with capacitor electrodes on different parts of the package or container that form a capacitor. The present invention allows the packager to create at least the complementary capacitor electrode in any way that makes sense (e.g., printing with any of a variety of materials, by any of a variety of techniques, on any of a variety of substrates, or directly onto the package or container).

[0051] FIG. 1 shows a schematic for a security device on a closed container (left hand side) and an open container (right hand side). The security device includes a continuity sensor 10 connected to capacitor electrodes 20 and 22 that form a capacitor with a complementary capacitor electrode 30. The capacitor electrodes 20 and 22 are on the same part of the container as the continuity sensor 10, and the complementary capacitor electrode 30 is on a different, moveable or separable part of the container. The continuity sensor 20 is connected to a communication device 40 (e.g., a display) that communicates the continuity state of the container. The capacitor formed by the closed container (left hand side) has a capacitance that is significantly greater than the capacitance of the capacitor formed by the open container (on the right-hand side).

[0052] FIG. 2 shows an exemplary security device 100. The security device 100 includes first and second main capacitor electrodes, a continuity sensor or integrated circuit 110 and an antenna 120 on a substrate 105. Connection pads 125a-b connect the antenna 120 to the integrated circuit 110. A strap on the opposite side of the substrate 105 connects the connection pad 125a to the connection pad 125b.

[0053] The first main capacitor electrode in the security device 100 comprises a first segment 130 and a second segment 134. The second main capacitor electrode comprises a first segment 132 and a second segment 136. The first segments 130 and 132 electrically connect the second segments 134 and 136 to the continuity sensor or integrated circuit 110, respectively. The first segments 130 and 132 may each be of any length necessary to electrically connect the continuity sensor or IC 110 to the second segments 134 and 136, and may have a width of from 10 to 1000 micrometers (or any value or range of values therein), although the invention is not limited to such values. The second segments 134 and 136 are parallel to and aligned with the edge of the substrate 105. The closest edge of the substrate 105 to the second segments 134 and 136 is configured to be placed next to an interface between two parts of the package or container that are separable or moveable relative to each other. The second segments 134 and 136 thus act as capacitor electrodes that form one or more capacitors with complementary capacitor electrode(s) on the other of the two separable or moveable parts of the package or container. As shown, the second segments 134 and 136 may each have (i) a length of from about 25% to less than 50% of the length of the nearest edge of the substrate 105 (or any value or range of values therein) and (ii) a width of from 10 micrometers to 10 millimeters (or any value or range of values therein), although the length and width of the second segments 134 and 136 are not limited to these values. The second segments 134 and 136 may be from about 20 micrometers to about 5 millimeters (or any value or range of values therein) from the nearest edge of the substrate 105.

[0054] As shown, the substrate 105 for the wireless security device 100 of FIG. 2 is rectangular or substantially rectangular, although the substrate 105 may have another shape suitable for a particular application (e.g., such as t-shaped, oval, triangular, rectangular, hexagonal, rectangular with rounded corners, another quadrilateral with or without rounded corners, tapered, elongated or as otherwise described herein). In exemplary embodiments, the substrate 105 may comprise paper, a polymer (e.g., a high temperature polymer such as polyethylene naphthalate [PEN] or polyethylene terephthalate [PET], nylon, polyvinyl alcohol and copolymers thereof [e.g., ethylene-vinyl alcohol (EVOH) copolymers], polyvinyl chloride [PVC], polypropylene [PP], polychlorotrifluoroethylene [PCFE; e.g., ACLAR ^® pharmaceutical packaging film, available commercially from Honeywell], polyethylene [PE; e.g., high density PE (HDPE)]), a metal layer or foil (e.g., comprising aluminum, stainless steel or copper), paper, a laminate or other combination thereof, etc. The security device 100 can be covered and/or protected with a coating or seal of one or more layers of insulation (e.g., plastic, paper, a laminate thereof, etc.).

[0055] In exemplary embodiments, the integrated circuit / continuity sensor 110 is an integrated circuit including a continuity sensor electrically connected to the segments 130 and 132. The continuity sensor may comprise a voltage or current detector, or a reference current or voltage source and a comparator. Optionally, the continuity sensor may include a voltage or current source, a buffer and/or an amplifier. The continuity sensor may output a digital or analog signal corresponding to the continuity state of the package or container.

[0056] The integrated circuit 110 may further include a memory (not shown) including one or more bits (e.g., a plurality of bits) configured to store the value corresponding to a continuity state of a container or package on which the substrate 105 is attached or secured. The memory may also include a plurality of bits that store identification information (e.g., a device identification number), information about the product inside the package or container, information from at least one other sensor, information regarding a characteristic delay in any signal transmitted by the security device 100, etc.

[0057] In some embodiments, the integrated circuit 110 includes one or more printed layers. For example, memory bits storing information that does not change (e.g., device identification information, instructions) may be formed by printing one or more layers of the memory, similar to a read-only memory (ROM). In one example, the integrated circuit is an "all-printed" integrated circuit (i.e., all or substantially all layers are printed layers). In further embodiments, the integrated circuit 110 includes one or more thin films, as an alternative to or in combination with one or more printed layer(s). In any of these embodiments, the IC 110 can be formed directly on the substrate 105.

[0058] In some embodiments, the antenna 120 may comprise a coil, concentric rings or a plurality of loops or "rings" in a spiral. For example, the number of loop or "rings" may be from 2 to about 50, or any natural number or range of natural numbers therein. Alternatively, the shape of the antenna 120 may be a square, rectangular, oval or serpentine, and may have dimensions that match any of multiple form factors, while preserving compatibility with reader hardware (e.g., the NFC 13.56 MHz target frequency). The antenna 120 may be printed (e.g., using a printed conductor such as, but not limited to, silver from a silver paste or ink) or formed using conventional methods such as blanket deposition and etching (e.g., by sputtering or evaporating aluminum on the substrate 105 and patterning by low-resolution [e.g., 10-1,000 μιη line width] photolithography and wet or dry etching).

[0059] In one embodiment, the IC 110 is formed on or attached to ends of the segments 130 and 132, the outer end 140 of the antenna 120, and the trace connected to the pad 125b. Alternatively, the IC 110 is built up layer by layer on the substrate 105, and the traces on the substrate 105 (including capacitor electrode segments 130 and 132, the antenna outer end 140, and the trace connected to pad 125b) are connected to pads or bumps on the upper surface of the IC 110. The ends of the segments 130 and 132, the antenna outer end 140 and the trace connected to pad 125b may thus be formed in contact with conductive pads on the IC 110 that are, in turn, connected to circuitry in the IC 110.

[0060] The inner end of the antenna 120 may terminate in a first pad 125a, which is conventionally connected to a second pad 125b that is electrically connected to the integrated circuit 130. In one example, a strap is formed on the opposite side of the substrate 105 from the IC 110 and bonded to the pads 125a-b through vias in the substrate 105. Alternatively, the strap can be formed on an interposer (i.e., an insulating substrate) and bonded to the pads 125a-b through vias in the interposer or in a dielectric layer formed over the strap.

[0061] In the alternative embodiments shown in FIGS. 3A-B, the integrated circuit

110' may function as such a strap when formed on an electrically insulating interposer (a so- called "integrated interposer"). In such embodiments, the integrated circuit 110' includes first and second pads 112a-b (that connect to antenna pads 125a-b) and third and fourth pads 114a-b (that connect to pads 131 and 133 at the ends of capacitor electrode segments 150 and 152 on the substrate 105'). With the exception of antenna pad 125a being on the inside of the antenna 120' and antenna pad 125b being on the outside of the antenna 120', the various pads may be in any location as long as the first and second pads 112a-b overlap with the antenna pads 125a-b, and the third and fourth pads 1 14a-b overlap with the capacitor electrode pads 131 and 133. FIG. 3B shows the IC 110' electrically connected to the antenna 120' and the segments 150 and 152 through the first and second pads 112a-b and the third and fourth pads 114a-b, respectively (e.g., by soldering, a conductive paste or adhesive, etc.).

[0062] The capacitor electrode segments 150 and 152 electrically connect the integrated circuit 110' and the capacitor electrodes 154 and 156, respectively. The capacitor electrodes 154 and 156 are aligned with and parallel to a nearest edge of the substrate 105'. In contrast to the capacitor electrodes 134 and 136 that form an L-shape in FIG. 2, the capacitor electrodes 154 and 156 connect to and form a T- or h-shape with segments 150 and 152 in FIGS. 3A-B.

[0063] FIG. 4A shows an exemplary integrated security device 200 including a display 210, an integrated circuit 110, a battery 220 and a main capacitor electrode on a substrate 205. The main capacitor electrode includes a first segment 225 and a second segment 230. The second segment 230 is electrically connected to the integrated circuit 110 by the first segment 225. The second segment 230 is aligned with and parallel to an edge of the substrate 205.

[0064] The security device 200 is secured to a container 250 (e.g., a paperboard envelope or other package that can be opened using a tear strip 215). The integrated circuit 110 may be the same or substantially the same as the integrated circuit 110 in FIG. 2 and/or the integrated circuit 110' in FIGS. 3A-B. When the container 250 is sealed, the second capacitor electrode segment 230 forms a capacitor with a metal line or layer 217 on the tear strip 215. If the metal line or layer 217 extends along substantially the entire tear strip 215, the security device 200 can be placed anywhere along and adjacent to the tear strip 215. It is not required for the metal line or layer 217 to be electrically connected to the integrated circuit 110 as long as it can capacitively couple to the main capacitor electrode (e.g., the second capacitor electrode segment 230).

[0065] The display 210 may show the continuity state of the container 250 by displaying a text message such as "Authentic Product" or other visual indication such as a green light when the container 250 is sealed (e.g., at the time of factory production or packaging). The display 210 may also show other information about the product or the conditions under which the product was shipped and/or stored, a message from the manufacturer or reseller, etc. [0066] In some embodiments, the integrated security device 200 may further comprise an antenna (not shown), and the integrated circuit 110 may be further configured to process wireless signals to or from a reader (e.g., an RF- or NFC-enabled smart phone or tablet computer). In such embodiments, the manufacturer and/or reseller may send a message or other information to the consumer depending on the continuity state of the container 250. For example, when the continuity state of the container 250 is sealed (or its equivalent), the manufacturer and/or reseller may send product price information and/or information about other products with which the product in the container 250 may be advantageously used. On the other hand, when the continuity state of the container 250 is opened, the manufacturer and/or reseller may send use information for the use of product, such as instructions for assembly or use, recipes (for food or beverage products), etc. In a further embodiment, the display 210 may further comprise a touch screen to enable the user to input information or data to send to manufacturer or reseller.

[0067] FIG. 4B shows the container 250 after it has been opened and the tear strip

215 has been removed. The capacitor formed by second segment 230 has a zero or substantially zero capacitance in this state. In this state, the display 210 shows a different continuity state of the container 250 by displaying a text message such as "OPENED" or other visual indication such as a red light when the container 250 is opened, and the capacitor formed by the second segment 230 and the metal line or layer 217 has been capacitively decoupled.

[0068] FIG. 5 A shows a tray 300 with a sliding lid 310. The lid 310 is mated to the tray 300 with a tongue -in-groove fitting. A security device 500 is attached to the sliding lid 310. The security device 500 includes an antenna 120, capacitor electrodes 134 and 136, and an integrated circuit 110 on a substrate 105. The capacitor electrodes 134 and 136 form a capacitor with a metal strip 320 on an uppermost surface of the tray 300 when the sliding lid 310 is closed. As shown, the edge of the substrate 105 closest to (and aligned with and/or parallel to) capacitor electrodes 134 and 136 may be proximate to, aligned with and/or parallel to an edge of the lid 310.

[0069] When the sliding lid 310 is closed, the capacitor formed by the capacitor electrodes 134 and 136 and the metal strip 320 has a first, measurable capacitance. In this state, the capacitance can be measured (e.g., precisely or crudely), and a threshold for comparing the capacitance during a continuity state determination can be set to a value that is less than the measured capacitance (e.g., < 90%, < 50%, < 20%, or any other value or percentage less than the measured capacitance), but that is still easily detectable using the continuity sensor. When the sliding lid 310 is opened, the capacitor is capacitively decoupled and has a zero or substantially zero second capacitance, thereby providing facile determination of the continuity state of the container using the capacitance of the capacitor formed by the main electrodes 134 and 136 and the complementary electrode 320.

[0070] FIG. 5B shows an alternative tray 300' with an alternative sliding lid 310'.

The security device 500 is attached to a side wall of the tray 300'. The lid 310' fits into grooves 305a-b to close the tray. The capacitor electrodes 134 and 136 form a capacitor with a metal strip 320' on the side or lip of the sliding lid 310' when the sliding lid 310' is closed. The capacitor has a measurable capacitance when the lid 310' is closed. In this case, the edge of the substrate 105 closest to (and aligned with and/or parallel to) capacitor electrodes 134 and 136 may be proximate to, aligned with and/or parallel to the edge of the lid 310' along the groove 305a. When the sliding lid 310' is open, the capacitor formed by the the capacitor electrodes 134 and 136 and the metal strip 320' is capacitively decoupled and has a zero or substantially zero capacitance.

[0071] FIG. 5C shows a jar 330 with a metal lid 340. A security device 510 is attached to the jar 330. The security device 510 includes an antenna 120, a capacitor electrode 160, and an integrated circuit 110 on a substrate 105. The capacitor electrode 160 forms a capacitor with the metal lid 340 when the jar is closed. The edge of the substrate 105 closest to (and aligned with and/or parallel to) capacitor electrode 160 may be proximate to, aligned with and/or may be proximate to, aligned with and parallel to an interface between the jar 330 and the metal lid 340. In this state, the capacitance can be measured (e.g., crudely), and a threshold for comparing the capacitance during a continuity state determination can be set to a value that is less than the measured capacitance but still detectable using the continuity sensor. When the metal lid 340 is removed from the jar 330, the capacitor formed by the capacitor electrode 160 and the metal lid 340 is capacitively decoupled and has a zero or substantially zero second capacitance. When the metal lid 340 is loose, the capacitance between the capacitor electrode 160 and the metal lid 340 may be between the threshold and zero, enabling detection of a "partially open" (or "partially closed") continuity state.

[0072] FIG. 5D shows a package or container 360 (e.g., a folding carton with a hinged flap 370 having a tuck flap 375 foldably attached thereto) and a security device 520 thereon. Alternatively, the package 360 can also be a different type of container with a hinged lid, such as a clamshell container. The security device 520 includes an antenna 120, a capacitor electrode including a first segment 130 and a second segment 134, and an integrated circuit 110 on a substrate 105. The security device 520 is attached to the folding carton 360 such that an edge of the substrate 105 nearest to the capacitor electrode 134 is proximate to and substantially aligned with an edge of the interface between a sidewall of the carton 360 and the lid 370. The first segment 130 connects the second segment 134 to the integrated circuit 110.

[0073] The second segment 134 forms a capacitor having a measurable capacitance with a metal strip 380 on the hinged lid 370 when the lid 370 on the folding carton 360 is closed. When the lid 370 is lifted to open the folding carton 360, the capacitor formed by the second segment 134 and the metal strip 380 is capacitively decoupled and has a zero or substantially zero second capacitance. The substrate 105 and the metal strip 380 may be proximate to, parallel to and/or substantially aligned with the interface between the hinged lid 370 and the folding carton 360. Thus, although the security device 520 is shown on the front wall of the folding carton 360, the security device 520 and the metal strip 380 may be placed opposite from each other on opposite sides of the interface between either side wall of the folding carton 360 and the hinged lid 370 because the hinged lid 370 moves relative to these walls of the folding carton 360.

[0074] FIG. 5E shows a corrugated box 390 with moveable, hinged flaps 391a-b with a security device 530 thereon. The security device 530 includes an antenna 120, main capacitor electrodes 170 and 172, connection pads 392a-b, and an integrated circuit 110 on substrate 105. The security device 530 is attached to a first end panel of the corrugated box 390 such that an edge of the substrate 105 nearest to the capacitor electrodes 170 and 172 is proximate to and aligned or substantially aligned with an edge of the interface between the first end panel of the box 390 and each of the hinged flaps 391a-b. [0075] Complementary capacitor electrodes 174 and 176 are formed on the first end panel of the box 390, on comers of the adjacent side panels of the box 390, then along the hinged flaps 391a-b so that parts of the capacitor electrodes 174 and 176 are along an edge of the hinged flaps 391a-b nearest to the interface between the hinged flaps 391a-b and the first end panel of the box 390. The complementary capacitor electrodes 174 and 176 are connected to the integrated circuit 110 through the connection pads 392a-b. The main capacitor electrodes 170 and 172 form capacitors having measurable capacitances with complementary capacitor electrodes 174 and 176 when the box 390 is closed. When the hinged flaps 391a-b are lifted to open the box 390, the capacitors formed by the main capacitor electrodes 170 and 172 and the complementary capacitor electrodes 174 and 176 are capacitively decoupled and have zero or substantially zero capacitances. If only one of the hinged flaps 391a-b is lifted, one of the capacitors has a measurable capacitance (e.g., about half of the total capacitance of capacitors when the box 390 is closed), and the other capacitor has a zero or substantially zero capacitance.

[0076] FIGS. 6A-B show the corrugated box 390 as shown in and described with respect to FIG. 5E, except that the main capacitor electrodes 180 and 182 are on the side wall or end panel of the box 390 instead of the substrate 105. Connection pads 393a-b on the side wall of the box 390 and at the ends of capacitor electrodes 180 and 182, respectively, connect to connection pads 394a-b on the substrate 105, and connection pads 392a-b on the side wall of the box 390 and at the ends of the complementary capacitor electrodes 174 and 176, respectively, connect to connection pads 395a-b on the substrate 105. The connection pads 394a-b and 395a-b are at the ends of traces on the substrate 105 that are electrically connected to the continuity sensor in the integrated circuit 110. FIG. 6A shows the box 390 before the substrate 105 is attached. FIG. 6B shows the box 390 after the substrate 105 is attached. The main capacitor electrodes 180 and 182 are printed on the same side wall of the box 390 onto which the substrate 105 is attached. The complementary capacitor electrodes 174 and 176 are formed (e.g., by printing) on the same side wall of the box 390 onto which the substrate 105 is attached, in addition to corners of second and third side walls of the box 390 and along the edge of the moveable, hinged flaps 391a-b closest to the main capacitor electrodes 180 and 182 so that the complementary capacitor electrodes 174 and 176 (i) do not cross the interface between the moveable, hinged flaps 391a-b and the side wall of the box 390 onto which the substrate 105 is attached and (ii) form capacitors with the main capacitor electrodes 180 and 182.

[0077] FIG. 7 shows an exemplary integrated circuit 400 for use in the present wireless security device. Some or all of the circuit and/or functional blocks in the exemplary integrated circuit 400 can be present in the integrated circuit 110 in FIGS. 2, 4A-B, 5A-E, and 6A-B, and the integrated circuit 110' in FIGS. 3A-B. Additional circuit blocks, such as one or more display drivers, can also be included in certain embodiments.

[0078] The exemplary integrated circuit (IC) 400 for use with the present security device includes one or more sensors 410, a threshold comparator 420 receiving information (e.g., a signal) from the sensor(s) 410, a pulse driver 440 receiving an output of the threshold comparator 420, a memory 460 storing sensor data from the pulse driver 440, one or more bit lines (BL) 472 for reading data from the memory 460, one or more sense amplifiers (SA) 474 for converting the signal(s) on the bit line(s) to digital signals, one or more latches 476 for temporarily storing data from the sense amplifier(s), and a transmitter (e.g., modulator) 490 configured to output data (including an identification code) from the device. The exemplary IC 400 in FIG. 7 also contains a clock 450 configured to provide a timing signal (e.g., CLK) that controls the timing of certain operations in the IC 400 and a memory timing control block or circuit 470 that controls the timing of memory read operations. The modulator 490 also receives the timing signal (CLK) from the clock circuit or a slowed-down or sped-up variation thereof. The exemplary IC 400 also includes a power supply block or circuit 480 that provides a direct current (e.g., VCC) to various circuits and/or circuit blocks in the IC. The memory 460 may also contain identification code. The portion of the memory 460 containing identification code may be printed. The IC 400 may further contain a receiver (e.g., a demodulator), one or more rectifiers (e.g., a rectifying diode, one or more half-bridge or full-bridge rectifiers, etc.), one or more tuning or storage capacitors, etc. Terminals in the modulator 490 and the power supply 480 may be connected to ends of an antenna (e.g., at Coill and Coil2). Alternatively, the modulator may be omitted or replaced with one or more display drivers, for example, and the power supply 480 may be connected to one or more leads electrically connected to a battery and optionally a ground plane or other ground potential. [0079] The memory in an NFC or RF security device may contain a fixed number of bits. In some implementations, NFC tags may contain 128 or 256 bits. Some bits are allocated to overhead (non-payload) data for format identification and data integrity (CRC) checking. The payload of the device (e.g., the NFC or RF device) consumes the remainder of the bits. For example, the payload can be up to 96 bits in the case of the 128-bit NFC tag and up to 224 bits in the case of the 256-bit NFC tag.

[0080] The payload of the NFC device can be allocated to variable amounts of fixed

ROM bits (which are generally - but not always - used as a unique identification number). When print methods are used in manufacturing the NFC, the ROM bits are permanently encoded and cannot be electrically modified. Any payload bits that are not allocated as fixed ROM bits can be allocated as dynamic sensor bits (e.g., for the continuity sensor). These sensor bits can change values, based on a sensed input. Different splits or allocations between ROM and sensor bits are indicated by data format bits that are part of the non- payload or Overhead' bits, generally in the first 16 bits of the NFC tag memory.

[0081] One example of how continuity sensing may be implemented in the present invention involves a sensor 410 that detects the capacitance of the sense capacitor (e.g., as shown in FIGS. 1, 2, 3A-B, 4A-B, 5A-E and 6A-B). The detected capacitance is compared to a threshold capacitance in the threshold comparator 420, which outputs a digital or analog value corresponding to a continuity state of the package or container, and the pulse driver 440 stores the value in the memory 460. In a relatively simple example, when the detected capacitance is equal to or greater than the threshold capacitance, the package or container is closed, and when the detected capacitance is less than the threshold capacitance, the package or container is open. In a more complex example, when the detected capacitance is equal to or greater than a first threshold capacitance, the package or container is closed, when the detected capacitance is less than a second threshold capacitance significantly less than the first threshold capacitance, the package or container is open, and when the detected capacitance is equal to or greater than the second threshold capacitance and less than the first threshold capacitance, the package or container is partially open or partially closed. Thus, one or more continuity state bits in the memory 460 store a state that reflects the detected capacitance. This indicates to the reader (e.g., an NFC smartphone, etc.) that the protected container is closed or has been opened. The ROM ID bits do not change, but any data integrity bits (e.g., for CRC) may be updated to reflect the continuity state of the package or container.

[0082] Continuity sensing generally refers to a capability and/or function that senses or determines whether a container has been tampered with or opened on the one hand, or remains in a closed state (e.g., its factory-sealed condition) on the other hand. In various embodiments, continuity sensing is implemented using one or more main capacitor electrodes on one part of the package or container and one or more complementary capacitor electrodes on a different, separable or independently moveable part of the package or container. The present sense capacitor may be thought of as having two parts: a first part that includes one or more main capacitor electrodes, and a second part that includes one or more complementary capacitor electrodes. The wireless security device and the main capacitor electrode(s) are on a first part of the protected container. The complementary capacitor electrode(s) are on a second, separable part of the protected container and/or a sealing device or mechanism such as a cap or lid that may move relative to the container (e.g., a bottle, jar or tray) upon opening. The main capacitor electrode(s) and the complementary capacitor electrode(s) form one or more capacitors, the capacitance of which can be sensed to determine the continuity state of the container. For example, the capacitor electrodes may be on opposite sides of an interface between the two separable parts of the container. Opening the container or packaging along or across the interface generally decouples the capacitor (e.g., the capacitance goes to zero), making it relatively easy to detect an open state of the container. Closing the container may re-establish a measurable capacitance in the capacitor, thereby realizing a reusable continuity detector and/or security device.

[0083] The IC 400 in the present device may include one or more other sensors in addition to the continuity sensor(s). For example, the IC 400 can further include one or more temperature sensors, humidity sensors, electromagnetic field sensors, current / voltage / power sensors, light sensors, and/or chemical sensors (e.g., for oxygen, carbon monoxide, carbon dioxide, nitrogen oxides, sulfur dioxide and/or trioxide, ozone, one or more toxins, etc.). The present IC may also include one or more time sensors (e.g., configured to count or determine elapsed time), which may include the clock circuit (which can be a basis for a realtime clock) and one or more counters, dividers, etc., as is known in the art. Such sensors may be on the same substrate as the antenna and the IC, or on a different substrate that is electrically connectable to the antenna and the IC or the continuity sensor (which may be part of the IC).

[0084] FIG. 8 shows a flow chart for an exemplary method 500 of applying a security device (e.g., an NFC and/or RFID tag) having a continuity sensor therein to a package or container and sensing a continuity state of the package or container in accordance with embodiments of the present invention. The present method advantageously enables manufacture of a universal or standard integrated circuit with a continuity sensor therein that can be electrically connected to an antenna or other communication mechanism (which can be made in a standardized way) and one or more capacitors that can be customized for a package or container in accordance with the dimensions, design and/or materials of the package or container.

[0085] At 510, complementary capacitor electrode(s) may be formed or fabricated on a separable part of a package or container. The complementary capacitor electrode(s) may be parallel and adjacent to an interface between separable or openable parts of the package or container. In various embodiments, the separable or openable parts of the package or container include sealable flaps in or on a box, a lid (hinged or unhinged) on a box or tray, a cap on a bottle or jar, a cork in a bottle, a flap or strip on an envelope, a plastic or paper seal over a well in a plastic container or tray, etc.

[0086] Separately, at 520, an antenna is formed or fabricated on a surface of a substrate. The antenna may be configured to receive and/or transmit or broadcast a wireless signal. In some embodiments, forming the antenna may consist of forming a single metal layer on the substrate, and etching the single metal layer to form the antenna. In other embodiments, forming the antenna may comprise printing a metal ink on the substrate in a first pattern corresponding to the antenna and converting the metal ink (e.g., by heating and/or chemical reduction) to a metal. Printing may include screen printing, inkjet printing, gravure printing, roll-to-roll printing, etc.

[0087] Alternatively, the security device may include a display and a battery instead of (or in addition to) an antenna. The display may be made conventionally on a separate substrate, for example by printing, thin film processing, roll-to-roll processing, a combination thereof, etc. Similarly, the battery may be made conventionally on the same substrate as the display or on a separate substrate. Similar to the antenna, the battery may be formed by printing, thin film processing, roll-to-roll processing, a combination thereof, etc. If made on a separate substrate, the battery may be attached to the display substrate (or other substrate, such as that on which the integrated circuit is formed) using surface mount technology (SMT) equipment and/or processing.

[0088] Forming the display may comprise forming a first electrode on the substrate, forming a photoactive layer thereon, and forming a second electrode on the photoactive layer. Forming the display may further comprise forming a transparent window over the electrodes and photoactive layer, if necessary (e.g., when the display is not formed on a transparent substrate or a substrate having a transparent window therein). At least one of the first and second electrodes may be transparent.

[0089] In addition, forming the battery may comprise forming a first current collector layer on the same substrate or a separate substrate, forming a cathode or anode thereon, forming an electrolyte layer on the cathode or anode, forming the other of the cathode or anode on the electrolyte layer, and forming a second current collector layer on the other of the cathode or anode. The layers of the battery may be formed by blanket deposition and (where desired) patterning, or by printing (as described herein). A sealant layer may be formed over the entire battery after all other layers are formed.

[0090] At 530, an integrated circuit may be formed on the same or different substrate as the antenna (or, alternatively, the display and/or battery). Forming the integrated circuit may comprise printing one or more layers of the integrated circuit, and processing the remainder of the integrated circuit by thin film processing techniques. In one embodiment, all layers of the integrated circuit may be printed. Printing offers advantages over photolithographic patterning processes, such as low equipment costs, greater throughput, reduced waste (and thus, a "greener" manufacturing process), etc., and can be ideal for relatively low transistor-count devices such as near field, RFID, security and other devices. Furthermore, one or more layers of the integrated circuit may be printed using roll-to-roll processing.

[0091] Alternatively, the method may form all layers of the integrated circuit by one or more thin film processing techniques. Thin film processing also has a relatively low cost of ownership, and is a relatively mature technology, which can result in reasonably reliable devices being manufactured on a wide variety of potential substrates, including a machine direction oriented (MDO) film (which may have a preferential tearing direction). In some embodiments, the best of both approaches can be used, and the method may form one or more layers of the integrated circuit by one or more thin film processing techniques, and printing one or more additional layers of the integrated circuit.

[0092] The integrated circuit may be formed on a separate substrate and attached to the substrate on which the antenna (or the display and/or battery) is formed (e.g., by pick- and-place [surface mount] technology and/or processing), or directly on the same substrate. The integrated circuit may be formed before or after the antenna or the display and/or battery. Regardless of whether the integrated circuit is formed before or after the antenna, connection pads are formed on the integrated circuit substrate to which the ends of the antenna and optionally at least one capacitor electrode are electrically connected. Thus, the integrated circuit may have a first set of connection pads electrically connected to the antenna. Alternatively, the integrated circuit may have a second set of connection pads electrically connected to the display and/or a third of connection pads electrically connected to the battery. Additional sets of connection pads may be formed for electrical connection to additional components, such as additional capacitor electrode(s), an on/off switch and/or an additional sensor. One or more capacitor electrodes may be formed on the same substrate as the integrated circuit in a manner connecting the capacitor electrode(s) to the integrated circuit.

[0093] At 540, the integrated circuit and antenna (or display and battery) are placed on the package or container, typically in positions that enable formation of one or more capacitors between the capacitor electrode(s) and the complementary capacitor electrode(s). Placing the substrate on the package or container may include adhering or wiping the substrate onto the package or container manually, semi-automatically, and/or automatically. Additionally, pressure and/or heat may be applied to the substrate to assist with adhering the substrate to the package or container. Subsequently, the substrate may be further secured to the package or container with shrink wrap or plastic wrap (e.g., if the container is a bottle, a spinner and/or a capsule).

[0094] At 550, the closed state capacitance of the capacitor(s) is measured when the package or container is closed. In some embodiments, this provides a baseline or target point for setting thresholds for closed-state and open-state capacitances. For example, the threshold for a closed continuity state may be 10-90% of the closed-state capacitance (or average closed-state capacitance for a group of identical or substantially identical containers). The threshold for the open continuity state can be, e.g., less than or equal to 10% of the closed-state capacitance (or average closed-state capacitance). In other embodiments, measuring the closed-state capacitance provides a test for determining whether the packaging process was successful.

[0095] At 560, a continuity state of the package or container that the security device is placed on or over may be sensed or determined by comparing the currently measured capacitance to the closed state capacitance, or alternatively, the comparing the closed-state threshold to the open-state threshold. A digital continuity value can then be generated that communicates the continuity state (e.g., open or closed) of the package or container. The continuity value may be transmitted using the security device (e.g., through the antenna or the display). The continuity state of the package or container can be tested as many times as desired as long as the package including the security device and any complementary capacitor electrodes is not destroyed, and power is or can be supplied to the security device. The exemplary method of manufacturing the security device (s) and determining a continuity state of a package or container is complete at 570.

[0096] Thus, the present invention may concern a method of determining a continuity state of a package or container. The method includes forming capacitor electrodes on first and second separable parts of the package or container and one or more capacitors over an interface between the first and second separable parts of the package or container, and, using a continuity sensor electrically connected to the capacitor(s), sensing a continuity state of the package or container. The continuity sensor (or an integrated circuit including the continuity sensor) may be electrically connected to an antenna or to a display and battery. The capacitor(s) and continuity sensor are configured to sense or determine a continuity state of a package or container on which the security device is placed or to which the security device is fixed or adhered.

[0097] In some embodiments, the security device is a wireless security device (e.g., a near field and/or radio frequency security device). In such embodiments, the continuity state of the package or container is sensed by reading the wireless security device with an enabled reader (e.g., an NFC- or RF -enabled smart phone or tablet computer), and displaying the continuity state on the display of the reader. Alternatively, the security device includes a display, and the continuity state of the package or container is sensed by the continuity sensor in the integrated circuit, then displayed on the display.

CONCLUSION

[0098] The foregoing descriptions of specific embodiments of the present invention have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the invention to the precise forms disclosed, and obviously many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the Claims appended hereto and their equivalents.