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Patent Searching and Data


Title:
SEGMENT ROUNDNESS MEASURING DEVICE AND SEGMENT ROUNDNESS MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/109122
Kind Code:
A1
Abstract:
This segment roundness measuring device comprises a correction means (31) for correcting positional deviation due to eccentricity of a center of rotation (O1) of an erector turning portion (21) on the basis of an angle detected by an angle detector (50) and a distance measured by three or more distance meters (41 - 44) that are disposed on the erector turning portion (21) at mutually different angular positions.

Inventors:
OKADA TOSHIYUKI (JP)
Application Number:
PCT/JP2013/080529
Publication Date:
July 17, 2014
Filing Date:
November 12, 2013
Export Citation:
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Assignee:
HITACHI SHIPBUILDING ENG CO (JP)
International Classes:
G01B11/24; E21D11/40; G01C15/00
Foreign References:
JPS6272900A1987-04-03
JPH01263515A1989-10-20
JPH069118Y21994-03-09
JPH07224600A1995-08-22
JP2820011B21998-11-05
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
Hirokazu Miyazono (JP)
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