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Title:
SEISMIC ISOLATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2000/031436
Kind Code:
A1
Abstract:
A seismic isolation device (A) comprising a support (3) that supports an upper plate (1) for horizontal slide movement relative to a lower plate (2), and a rubber member (8) that elastically connects at least portions of the outer peripheries of the upper and lower plates (1, 2) so that it serves as an elastic body that will be deformed when the upper plate (1) is horizontally slid relative to the lower plate (2), wherein, in order to obtain satisfactory seismic isolation effects while reducing the horizontal dimension, the support (3) is made in the form of a lamination by vertically alternately stacking pluralities of resin plates (3a) and metal plates (3b) such that a metal plate (3b) and at least one of the resin plates (3a) adjoining the upper and lower sides of the metal plate (3b) will be relatively and horizontally slid upon occurrence of an earthquake.

Inventors:
Matsukawa, Hirokazu (Bando Chemical Industries, Ltd. 2-15 Meiwa-dori 3-chom, Hyogo-ku Kobe-shi Hyogo, 652-0883, JP)
Matsuoka, Hiroshi (Bando Chemical Industries, Ltd. 2-15 Meiwa-dori 3-chom, Hyogo-ku Kobe-shi Hyogo, 652-0883, JP)
Ohta, Ippei (Bando Chemical Industries, Ltd. 2-15 Meiwa-dori 3-chom, Hyogo-ku Kobe-shi Hyogo, 652-0883, JP)
Application Number:
PCT/JP1999/006638
Publication Date:
June 02, 2000
Filing Date:
November 26, 1999
Export Citation:
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Assignee:
BANDO CHEMICAL INDUSTRIES, LTD. (2-15, Meiwa-dori 3-chome Hyogo-ku Kobe-shi, Hyogo, 652-0883, JP)
Matsukawa, Hirokazu (Bando Chemical Industries, Ltd. 2-15 Meiwa-dori 3-chom, Hyogo-ku Kobe-shi Hyogo, 652-0883, JP)
Matsuoka, Hiroshi (Bando Chemical Industries, Ltd. 2-15 Meiwa-dori 3-chom, Hyogo-ku Kobe-shi Hyogo, 652-0883, JP)
Ohta, Ippei (Bando Chemical Industries, Ltd. 2-15 Meiwa-dori 3-chom, Hyogo-ku Kobe-shi Hyogo, 652-0883, JP)
International Classes:
E04H9/02; F16F3/00; F16F15/04; (IPC1-7): F16F15/02; E04H9/02
Foreign References:
JPS63102806U
JPS57123350A
JPH01268906A
Attorney, Agent or Firm:
Maeda, Hiroshi (Taihei Building 4-8, Utsubohonmachi 1-chome Nishi-ku Osaka-shi, Osaka, 550-0004, JP)
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