SELECTABLE AREA LASER ASSISTED PROCESSING OF SUBSTRATES

Title:

SELECTABLE AREA LASER ASSISTED PROCESSING OF SUBSTRATES

Document Type and Number:

WIPO Patent Application WO2004038870

Kind Code:

A3

Abstract:

A system and method for selectable area laser treatment of a substrate, such as thin film transistors, the system including a holder holding a substrate in proximity to reactant, and laser beams each addressing independently selectable mutually set apart locations on the substrate to induce a reaction between the substrate and the reactant.

More Like This:

JP7322813	Method for manufacturing fuel cell
WO/2018/011359	LASER CONDITIONING OF SOLID BODIES USING PRIOR KNOWLEDGE FROM PREVIOUS MACHINING STEPS
JP2000052069	START UP METHOD OF LASER MARKING DEVICE, AND ITS DEVICE

Inventors:

GLAZER ARIE (IL)
GROSS ABRAHAM (IL)

Application Number:

PCT/IL2003/000887

Publication Date:

December 02, 2004

Filing Date:

October 28, 2003

Export Citation:

Click for automatic bibliography generation Help

Assignee:

ORBOTECH LTD (IL)
GLAZER ARIE (IL)
GROSS ABRAHAM (IL)

International Classes:

B23K26/00; B23K26/067; B23K26/08; B23K26/14; B23K26/34; C23C14/58; H01L21/268; H01L21/302; H01L21/461; H01L21/20; H01L21/77; (IPC1-7): H01L21/336; H01L21/31

Foreign References:

US20030194509A1	2003-10-16
US6573531B1	2003-06-03
US6335509B1	2002-01-01

Download PDF:

View/Download PDF PDF Help

Previous Patent: SIGNAL DISTRIBUTION AMPLIFIER CABLE

Next Patent: GRATING-STABILIZED SEMICONDUCTOR LASER