SELF CROSS-LINKABLE POLYMER AND RESIST UNDERLAYER FILM-FORMING COMPOSITION

WIPO Patent Application WO/2023/189799

A1

Provided is a polymer resin material capable of forming a thermally cured film at a lower temperature without a cross-linking agent or cross-linking catalyst.　A self-cross-linkable polymer comprising unit structures A that have an aromatic ring and unit structures B that are organic groups with a connecting carbon atom, wherein: at least one kind of unit structure A is (i) a unit structure in which an -NR- bond connects at least two aromatic rings, (ii) a unit structure comprising a heterocyclic structure having at least one -NR- bond as a ring structural element, or (iii) a unit structure comprising an aromatic ring that has at least one -NR2 substituent group; R is a hydrogen atom or alkoxymethyl group; at least some of the Rs in the entire polymer are alkoxymethyl groups; and the connecting carbon atom is a carbon atom in a unit structure B that forms a covalent bond with an aromatic ring in a unit structure A and is a carbon atom that does not form an aromatic ring.

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KISHIKAWA YO (JP)
TOKUNAGA HIKARU (JP)

PCT/JP2023/010815

October 05, 2023

March 20, 2023

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NISSAN CHEMICAL CORP (JP)

C08G61/12; G03F7/11; H01L21/027

JP2021105703A	2021-07-26
JP2019044022A	2019-03-22
JP2019041059A	2019-03-14
CN110041345A	2019-07-23
US20140227887A1	2014-08-14

TSUKUNI & ASSOCIATES et al. (JP)

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