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Title:
SELF-WELDING HIGH DIELECTRIC SILICONE RUBBER COMPOSITION AND SELF-WELDING HIGH DIELECTRIC TAPE
Document Type and Number:
WIPO Patent Application WO/2018/207475
Kind Code:
A1
Abstract:
Provided are a self-welding high dielectric silicone rubber composition and a self-welding high dielectric tape. The self-welding high dielectric silicone rubber composition comprises: (A) 100 parts by mass of an organopolysiloxane represented by an average composition formula (1) and having, in a molecule, at least two alkenyl groups bonded to silicon atoms, R1 nSiO(4-n)/2 (1), (in the formula, R1 represents the same or different, unsubstituted or substituted monovalent hydrocarbon group and n is a positive number of 1.95 to 2.04); (B) 10 to 100 parts by mass of hydrophobic fumed silica having a specific surface area obtained by the BET adsorption method of 50 m2/g or larger: (C) 100 to 300 parts by mass of a conductive complex oxide; (D) 0.1 to 50 parts by mass of a boric acid or a boric acid compound; (E) 1 to 10 parts by mass of a diorganopolysiloxane capped at both molecular terminals with alkoxy groups; and (F) 0.01 to 10 parts by mass of a curing agent comprising an acyl organic peroxide. The self-welding high dielectric silicone rubber composition can be hot-air vulcanized under normal pressure by extrusion molding or roll forming with calender rolls.

Inventors:
OISHI Kazuhiro (Shin-Etsu Chemical Co. Ltd., 1-10, Hitomi, Matsuida-machi, Annaka-sh, Gunma 24, 〒3790224, JP)
KOIKE Yoshiaki (Shin-Etsu Chemical Co. Ltd., 1-10, Hitomi, Matsuida-machi, Annaka-sh, Gunma 24, 〒3790224, JP)
Application Number:
JP2018/011670
Publication Date:
November 15, 2018
Filing Date:
March 23, 2018
Export Citation:
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Assignee:
SHIN-ETSU CHEMICAL CO., LTD. (6-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
C08F299/08; C08K3/22; C08K3/36; C08K3/38; C08K5/14; C08L83/06; C08L83/07; H01B3/00; H01B3/46; H01B17/56
Foreign References:
JPH09143370A1997-06-03
JP2017039833A2017-02-23
JP2001179833A2001-07-03
JPH02229859A1990-09-12
JPH07207161A1995-08-08
JPH09231835A1997-09-05
JP2015153514A2015-08-24
JP2017002218A2017-01-05
JP2013177558A2013-09-09
JP2015076168A2015-04-20
JP2017039833A2017-02-23
JPS6241171B21987-09-01
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (GINZA OHTSUKA Bldg. 2F, 16-12 Ginza 2-chome, Chuo-k, Tokyo 61, 〒1040061, JP)
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