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Title:
SEMIAROMATIC POLYAMIDE, SEMIAROMATIC POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2014/073219
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a semiaromatic polyamide which has excellent heat resistance, chemical resistance and mechanical characteristics, while exhibiting moldability that is suitable for various component materials for automobiles and the like; and a molded article of this semiaromatic polyamide. A semiaromatic polyamide (I) of the present invention contains 35-50% by mole of a structural unit derived from terephthalic acid [A], 25-40% by mole of a structural unit derived from isophthalic acid [B], 15-35% by mole of a structural unit derived from an aliphatic dicarboxylic acid [C] (provided that the total of [A], [B] and [C] is 100% by mole), and a structural unit derived from an aliphatic diamine [D] having 4-12 carbon atoms. The molar ratio ([A]/[B]) is from 65/35 to 50/50, and the molar ratio ([C]/[B]) is from 30/70 to 50/50. The melting enthalpy (∆H) of the semiaromatic polyamide (I) as determined by differential scanning calorimetry (DSC) is 20-40 mJ/mg, and the limiting viscosity [η] of the semiaromatic polyamide (I) is 0.7-1.6 dl/g.

Inventors:
WASHIO ISAO
EBATA HIROKI
KAGEYAMA FUMIO
KOSAKA TOSHITAKA
OGASAWARA HIDETO
AMANO AKINORI
TAKIZAWA NOBUHIRO
Application Number:
PCT/JP2013/006663
Publication Date:
May 15, 2014
Filing Date:
November 12, 2013
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08G69/26; C08J5/04; C08K7/02; C08L23/00; C08L63/00; C08L77/06
Domestic Patent References:
WO2003085029A12003-10-16
Foreign References:
JPH03126725A1991-05-29
JPH05230205A1993-09-07
JPH05339494A1993-12-21
JPH05339494A1993-12-21
JPS60170664A1985-09-04
JPH10138372A1998-05-26
JP2003287165A2003-10-10
JP2007502728A2007-02-15
JP2003110736A2003-04-11
JP2017005233A2017-01-05
JP2012067150A2012-04-05
Other References:
See also references of EP 2918624A4
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
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