Title:
SEMICONDUCTOR AIR-CONDITIONING CARD, CUSHION, CHAIR AND MATTRESS
Document Type and Number:
WIPO Patent Application WO/2017/036057
Kind Code:
A1
Abstract:
A semiconductor air-conditioning card comprises a semiconductor cooling chip (3), a cool-end heat dissipation fin (4), a warm-end heat dissipation fin (2) and a vapor chamber (6) having a solvent in a vacuum cavity. A cool surface of the cool-end heat dissipation fin (4) and a cool surface of the semiconductor cooling chip (3) are connected, a warm surface of the semiconductor cooling chip (3) is connected to one end of the vapor chamber (6) having a solvent in a vacuum cavity, and the warm-end heat dissipation fin (2) is connected to the other end of the vapor chamber (6) having a solvent in a vacuum cavity.
Inventors:
XIA SHENGQING (CN)
Application Number:
PCT/CN2016/000480
Publication Date:
March 09, 2017
Filing Date:
August 29, 2016
Export Citation:
Assignee:
XIA SHENGQING (CN)
International Classes:
F25B21/02
Foreign References:
| US20100199687A1 | 2010-08-12 | |||
| CN201435971U | 2010-04-07 | |||
| CN105180503A | 2015-12-23 | |||
| CN204923550U | 2015-12-30 | |||
| CN201514074U | 2010-06-23 | |||
| CN201263532Y | 2009-07-01 | |||
| DE202005014260U1 | 2005-11-24 |
Attorney, Agent or Firm:
JINAN JINDI INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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