Title:
SEMICONDUCTOR APPARATUS AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/026511
Kind Code:
A1
Abstract:
The semiconductor apparatus according to an embodiment of the present invention comprises a substrate, a controller disposed on the substrate, a non-volatile memory disposed on the substrate separate from the controller, a first heat sink disposed in contact with an upper surface of the controller, a second heat sink disposed in contact with an upper surface of the non-volatile memory, and a first resin sealing body for sealing the controller, the non-volatile memory, the first heat sink, and the second heat sink. The first heat sink and the second heat sink are exposed at at least one of an upper surface or a side surface of the first resin sealing body. Provided is a semiconductor apparatus having improved heat dissipation characteristics.
Inventors:
MURAMATSU KEN (JP)
SHIMIZU SHINYA (JP)
SHIMIZU SHINYA (JP)
Application Number:
PCT/JP2022/001343
Publication Date:
March 02, 2023
Filing Date:
January 17, 2022
Export Citation:
Assignee:
KIOXIA CORP (JP)
International Classes:
H01L23/29; H01L23/00; H01L23/28; H01L23/36; H01L25/04; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2020047651A | 2020-03-26 | |||
| JP2014179611A | 2014-09-25 | |||
| JP2008218669A | 2008-09-18 | |||
| JP2016032074A | 2016-03-07 | |||
| JP2019087609A | 2019-06-06 | |||
| JP2003309195A | 2003-10-31 | |||
| US20190198489A1 | 2019-06-27 | |||
| JP2016063127A | 2016-04-25 | |||
| JP2021005674A | 2021-01-14 | |||
| JP2011035352A | 2011-02-17 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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