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Patent Searching and Data


Title:
SEMICONDUCTOR BACK SURFACE ADHERING FILM
Document Type and Number:
WIPO Patent Application WO/2019/131854
Kind Code:
A1
Abstract:
Provided is a semiconductor back surface adhering film which has excellent laser markability and excellent infrared shielding properties. A semiconductor back surface adhering film according to the present invention has a total light transmittance of 20% or less in the wavelength range of 500-1,300 nm. It is preferable that the difference between the total light absorbance at the wavelength of 500 nm and the total light absorbance at the wavelength of 1,300 nm of this semiconductor back surface adhering film is 2 or less. It is also preferable that this semiconductor back surface adhering film contains an infrared absorbent that has a maximum absorption wavelength of 850 nm or more in the wavelength range of 500-2,000 nm.

Inventors:
SATO SATOSHI (JP)
SHIGA GOSHI (JP)
TAKAMOTO NAOHIDE (JP)
Application Number:
PCT/JP2018/048086
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/00; C09J7/38; C09J11/04; C09J11/06; C09J133/00; C09J163/00; C09J201/00; G02B5/22; H01L21/301
Domestic Patent References:
WO2014148642A12014-09-25
Attorney, Agent or Firm:
GOTO & CO. (JP)
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