Title:
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE PROVIDED WITH SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2012/168959
Kind Code:
A1
Abstract:
The present invention addresses the issue of providing a semiconductor chip, wherein influence of stress to the semiconductor chip is reduced by means of simple process, said stress being generated due to secondary mounting, a semiconductor device provided with the semiconductor chip, and a method for manufacturing the semiconductor chip.
A semiconductor chip of the present invention is fixed on a chip supporting substrate by bonding using a die bond material, and the semiconductor chip is characterized in that the rear surface side of the semiconductor chip, which is fixed to the chip supporting substrate by the bonding, is formed in a recessed and projected shape that is configured of a bonding portion and a non-bonding portion.
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Inventors:
HASEGAWA KATSUHISA (JP)
Application Number:
PCT/JP2011/003169
Publication Date:
December 13, 2012
Filing Date:
June 06, 2011
Export Citation:
Assignee:
PIONEER CORP (JP)
PIONEER MICRO TECHNOLOGY CORP (JP)
HASEGAWA KATSUHISA (JP)
PIONEER MICRO TECHNOLOGY CORP (JP)
HASEGAWA KATSUHISA (JP)
International Classes:
H01L21/52; H01L21/301; H01L21/304
Foreign References:
| JP2010021251A | 2010-01-28 | |||
| JPH0278234A | 1990-03-19 |
Attorney, Agent or Firm:
OCHIAI, MINORU (JP)
Ochiai 稔 (JP)
Ochiai 稔 (JP)
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Claims: