Title:
SEMICONDUCTOR CHIP DEVICE WITH SOLDER DIFFUSION PROTECTION
Document Type and Number:
WIPO Patent Application WO/2011/084362
Kind Code:
A3
Abstract:
Various methods and apparatus for establishing thermal pathways for a semiconductor device using solder-type thermal material (90) are disclosed. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor chip (20) that has a substrate and a first active circuitry portion (40) extending a first distance into the substrate. A barrier (135),which inhibits the diffusion of solder, is formed in the first semiconductor chip (20) that surrounds but is laterally separated from the first active circuitry portion (40) and extends into the substrate a second distance greater than the first distance.
Inventors:
SU MICHAEL Z (US)
Application Number:
PCT/US2010/059981
Publication Date:
September 01, 2011
Filing Date:
December 11, 2010
Export Citation:
Assignee:
ADVANCED MICRO DEVICES INC (US)
SU MICHAEL Z (US)
SU MICHAEL Z (US)
International Classes:
H01L23/00; H01L25/065; H01L23/31; H01L23/42
Domestic Patent References:
| WO2010107542A1 | 2010-09-23 |
Foreign References:
| US20060006493A1 | 2006-01-12 | |||
| US20090057881A1 | 2009-03-05 | |||
| US20080093733A1 | 2008-04-24 | |||
| US20040251530A1 | 2004-12-16 | |||
| JPS6163042A | 1986-04-01 |
Other References:
See also references of EP 2517242A2
Attorney, Agent or Firm:
HONEYCUTT, Timothy (Tomball, TX, US)
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