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Patent Searching and Data


Title:
SEMICONDUCTOR CHIP AND SEMICONDUCTOR MODULE IN WHICH SAME IS USED
Document Type and Number:
WIPO Patent Application WO/2016/208122
Kind Code:
A1
Abstract:
Provided is a semiconductor chip. The semiconductor chip is provided with: switching elements (11a-16a) having gate electrodes; first control pads (71) electrically connected to the gate electrodes, a voltage for controlling the ON/OFF states of the switching elements being applied to the first control pads (71); and second control pads (72) constituting part of an electric-current path for channeling a control current with the first control pads when the switching elements are switched ON, the first control pads and the second control pads being positioned so that one type of pad is sandwiched by two of the other type of pad.

Inventors:
KOUNO KENJI (JP)
TANABE HIROMITSU (JP)
Application Number:
PCT/JP2016/002581
Publication Date:
December 29, 2016
Filing Date:
May 27, 2016
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L25/18; H02M7/48
Foreign References:
JP2013149684A2013-08-01
JP2015015301A2015-01-22
JPH11220034A1999-08-10
JP2014099444A2014-05-29
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
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