Title:
SEMICONDUCTOR CHIP AND SEMICONDUCTOR MODULE MOUNTED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2013/098929
Kind Code:
A1
Abstract:
In a conventional high-speed large-current semiconductor chip, all electrical connection terminals are disposed on one surface of the chip. For this reason, a large number of terminals have been assigned for power supply current flowing-in terminals and power supply current flowing-out terminals in order to supply stable power supply current and reduce noise mixed in a signal system from a power supply. Consequently, there have been the problems of increase in the number of terminals of a semiconductor device mounted with said semiconductor chip and increase in mounting area.
Electrical connection terminals are sorted into the terminals of a power supply system and the terminals of a signal system and are disposed on both sides of a semiconductor chip. A configuration that increases the allowable current value of a flow path through which a large current flows makes it possible, for example, to supply a stable power even with a small number of terminals, reduce noise mixed in the signal system, reduce the mounting area by the reduction of the number of pins, and increase a heat dissipation effect. With a semiconductor module mounted with this semiconductor chip, stable characteristics can also be obtained even in a high-speed operation with large current flow.
More Like This:
Inventors:
NAKAMURA HIROFUMI (JP)
Application Number:
PCT/JP2011/080134
Publication Date:
July 04, 2013
Filing Date:
December 26, 2011
Export Citation:
Assignee:
ZYCUBE CO LTD (JP)
NAKAMURA HIROFUMI (JP)
NAKAMURA HIROFUMI (JP)
International Classes:
H01L23/12; H01L21/3205; H01L23/52; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2001035964A | 2001-02-09 | |||
| JP2002118198A | 2002-04-19 | |||
| JP2009302198A | 2009-12-24 | |||
| JP2011061132A | 2011-03-24 |
Attorney, Agent or Firm:
IZUMI, Katsufumi (JP)
Spring Katsufumi (JP)
Spring Katsufumi (JP)
Download PDF:
Claims: