Title:
SEMICONDUCTOR CHIP MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/066462
Kind Code:
A1
Abstract:
Provided is a mounting device 100 in which two or more semiconductor chips 10 are laminated and mounted at a plurality of locations on a substrate 30, said mounting device 100 comprising: a stage 120 that supports the substrate 30; a bonding unit 122 that laminates and mounts the plurality of semiconductor chips 10 on the substrate 30 while heating the plurality of semiconductor chips and the substrate; and a heat-insulating member 126 that is interposed between the stage 120 and the substrate 30, said heat-insulating member 126 including a first layer 50 which is in contact with the substrate 30 and to which heat is applied from the bonding unit via the semiconductor chips and the substrate, and a second layer 52 which is disposed nearer to the stage 120 than the first layer 50, wherein the first layer 50 has a larger heat resistance than the second layer 52.
Inventors:
NAKAMURA TOMONORI (JP)
MAEDA TORU (JP)
MAEDA TORU (JP)
Application Number:
PCT/JP2017/035419
Publication Date:
April 12, 2018
Filing Date:
September 29, 2017
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2016162920A | 2016-09-05 | |||
| JP2009130293A | 2009-06-11 |
Attorney, Agent or Firm:
YKI PATENT ATTORNEYS (JP)
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