Title:
SEMICONDUCTOR CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/028778
Kind Code:
A1
Abstract:
Provided are a semiconductor chip package structure and a packaging method therefor. The semiconductor chip package structure comprises: a semiconductor chip, having a function area (111); a protective substrate, located on one side of the semiconductor chip and covering the function area (111); and a support unit, located between the protective substrate and the semiconductor chip and enclosing the function area (111). The support unit comprises an outer support member (212) and an inner support member (211) located on the inner side of the outer support member (212). A receiving cavity (213) is formed between the inner support member (211), the semiconductor chip and the protective substrate. A hollow cavity (214) is formed between the inner support member (211), the outer support member (212), the semiconductor chip and the protective substrate. The inner support member (211) is provided with at least one first gas-permeable structure (21, 22), through which the receiving cavity (213) is communicated with the hollow cavity (214), so that pressure generated by instant vaporization and expansion of water vapor is effectively released, thereby preventing cracking of the support unit.
Inventors:
WANG ZHIQI (CN)
LIU XIANGLONG (CN)
XU YUANHAO (CN)
LIU XIANGLONG (CN)
XU YUANHAO (CN)
Application Number:
PCT/CN2016/095416
Publication Date:
February 23, 2017
Filing Date:
August 16, 2016
Export Citation:
Assignee:
CHINA WAFER LEVEL CSP CO LTD (CN)
International Classes:
H01L21/58; H01L23/12
Foreign References:
| CN102651350A | 2012-08-29 | |||
| CN204991681U | 2016-01-20 | |||
| CN105185751A | 2015-12-23 | |||
| CN1685500A | 2005-10-19 | |||
| CN101414613A | 2009-04-22 | |||
| JP2004119881A | 2004-04-15 | |||
| CN103531488A | 2014-01-22 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
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