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Title:
SEMICONDUCTOR CHIP, SEMICONDUCTOR WAFER AND SEMICONDUCTOR CHIP MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/145310
Kind Code:
A1
Abstract:
The disclosed semiconductor chip (18) has a power semiconductor device (10) and is provided with a semiconductor substrate configured from a hexagonal crystal semiconductor. The main surface of the semiconductor substrate is rectangular, the two side lengths a and b which define the rectangle are identical, and the linear expansion coefficients in the directions parallel to the two sides of the semiconductor substrate are identical to one another.

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Inventors:
UCHIDA MASAO
HAYASHI MASASHI
Application Number:
PCT/JP2011/002685
Publication Date:
November 24, 2011
Filing Date:
May 13, 2011
Export Citation:
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Assignee:
PANASONIC CORP (JP)
UCHIDA MASAO
HAYASHI MASASHI
International Classes:
H01L21/02; H01L21/28; H01L29/06; H01L29/12; H01L29/417; H01L29/47; H01L29/78; H01L29/861; H01L29/872
Foreign References:
JP2002124473A2002-04-26
JPH10135576A1998-05-22
JP2007059552A2007-03-08
Attorney, Agent or Firm:
OKUDA, SEIJI (JP)
Seiji Okuda (JP)
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