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Title:
SEMICONDUCTOR CLEANING APPARATUS AND METHOD FOR CLEANING THROUGH HOLE BY USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/019639
Kind Code:
A1
Abstract:
Provided is a method for cleaning a through hole. The method comprises: heating a cleaning fluid to a preset temperature; mixing the cleaning fluid with an inert gas, and the mixture entering a cleaning cavity; atomizing the cleaning fluid in an atomizer (140, 540) and spraying same onto a surface of a wafer and same getting into an inner wall and the bottom of the through hole; and closing a valve for the cleaning fluid.

Inventors:
YAO, Daping (Building D1, China Sensor Network International Innovation Park 200 Linghu Boulevar, Wuxi Jiangsu 8, 214028, CN)
CAO, Liqiang (Building D1, China Sensor Network International Innovation Park 200 Linghu Boulevar, Wuxi Jiangsu 8, 214028, CN)
Application Number:
CN2018/121712
Publication Date:
January 30, 2020
Filing Date:
December 18, 2018
Export Citation:
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Assignee:
NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD. (Building D1, China Sensor Network International Innovation Park 200 Linghu Boulevar, Wuxi Jiangsu 8, 214028, CN)
International Classes:
H01L21/67
Foreign References:
CN1773674A2006-05-17
CN1773674A2006-05-17
CN102844845A2012-12-26
CN101096753A2008-01-02
CN101592875A2009-12-02
CN105344511A2016-02-24
JP6321353B22018-05-09
Attorney, Agent or Firm:
SHANGHAI ZHI-SHENG INTELLECTUAL PROPERTY OFFICE (Room No.501, Building No.51 1089 North Qinzhou Rd, Shanghai 3, 200233, CN)
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