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Patent Searching and Data


Title:
SEMICONDUCTOR COMPONENT HAVING A MULTI-LAYER STRUCTURE AND MODULE FORMED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2013/050563
Kind Code:
A3
Abstract:
The invention relates to a semiconductor component having a multi-layer structure, wherein a bypass diode is monolithically integrated into the semiconductor component. The invention further relates to modules that are constructed from several of said semiconductor components. The invention relates in particular to multi-junction solar cells in photovoltaics.

Inventors:
WIESENFARTH MAIKE (DE)
GUTER WOLFGANG (DE)
HELMERS HENNING (DE)
Application Number:
PCT/EP2012/069776
Publication Date:
June 06, 2013
Filing Date:
October 05, 2012
Export Citation:
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Assignee:
FRAUNHOFER GES FORSCHUNG (DE)
International Classes:
H01L31/0687; H01L27/142; H01L31/0725
Foreign References:
DE102004055225A12006-06-01
US20030075215A12003-04-24
Other References:
HENNING HELMERS ET AL: "Processing Techniques for Monolithic Interconnection of Solar Cells at Wafer Level", IEEE TRANSACTIONS ON ELECTRON DEVICES, IEEE SERVICE CENTER, PISACATAWAY, NJ, US, vol. 57, no. 12, 1 December 2010 (2010-12-01), pages 3355 - 3360, XP011319802, ISSN: 0018-9383
LOECKENHOFF R ET AL: "1000 Sun, Compact Receiver Based on Monolithic Interconnected Modules (MIMS)", CONFERENCE RECORD OF THE 2006 IEEE 4TH WORLD CONFERENCE ON PHOTOVOLTAIC ENERGY CONVERSION (IEEE CAT. NO.06CH37747), IEEE, 1 May 2006 (2006-05-01), pages 737 - 740, XP031007410, ISBN: 978-1-4244-0016-4
Attorney, Agent or Firm:
PFENNING, MEINIG & PARTNER GBR (München, DE)
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