Title:
SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/129697
Kind Code:
A1
Abstract:
A semiconductor component and a manufacturing method therefor. The semiconductor component comprises a substrate (106), a bonding metal layer (105), a reflective layer (104), a first conductive layer (101), an active layer (102), a second conductive layer (103), a first electrode (107), and a second electrode (108). The first electrode (107) extends to the first conductive layer (101) from one side of the bonding metal layer (105) distant from the substrate (106), and is connected to the bonding metal layer (105) and the first conductive layer (101). The second electrode (108) runs through the substrate (106) and the bonding metal layer (105), and is in contact with the reflective layer (104). In the semiconductor component, a structure for sharing the first conductive layer (101) is formed, so that exit light is more uniform, the light extraction rate is higher, interference among pixel units is eliminated, the light-emitting wavelength is more uniform, and a current flowing through different pixel units is more uniform.
Inventors:
ZHANG LIYANG (CN)
Application Number:
PCT/CN2017/070990
Publication Date:
July 19, 2018
Filing Date:
January 12, 2017
Export Citation:
Assignee:
ENKRIS SEMICONDUCTOR INC (CN)
International Classes:
H01L33/36
Foreign References:
| US20120007120A1 | 2012-01-12 | |||
| CN103383949A | 2013-11-06 | |||
| CN103390713A | 2013-11-13 | |||
| CN103794689A | 2014-05-14 | |||
| CN102738342A | 2012-10-17 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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