Title:
SEMICONDUCTOR DEVICE, ANTIOXIDATION METAL MATERIAL USED THEREFOR, AND SPUTTERING TARGET AND DEPOSITION SOURCE FOR SAID METAL MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/090196
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide a semiconductor device having an antioxidation metal film that is less expensive than prior-art Au films, that functions as a protective film for a metal film for soldering of a similar degree, that prevents organic substances from contaminating the metal film for soldering, and that ensures sufficient solder wettability. In a semiconductor device 100 according to the present disclosure a substrate 2 has at a minimum provided thereon: a metal film for soldering 5; an antioxidation metal film 6 provided on the metal film for soldering 5, said antioxidation metal film 6 suppressing oxidation of the metal film for soldering 5; and a solder part 7 joined to the antioxidation metal film 6 together with the metal film for soldering 5. The metal film for soldering 5 is an Ni film or an Ni alloy film, and the antioxidation metal film 6 is an Au-Ag based alloy film.
Inventors:
WADA SHUYA (JP)
MATSUMURA TAKANOBU (JP)
ISHIGURO YOSHIHIRO (JP)
MATSUMURA TAKANOBU (JP)
ISHIGURO YOSHIHIRO (JP)
Application Number:
PCT/JP2022/041477
Publication Date:
May 25, 2023
Filing Date:
November 08, 2022
Export Citation:
Assignee:
FURUYA METAL CO LTD (JP)
International Classes:
H01L23/532; H01L21/28; H01L21/285; H01L21/52; H01L23/482; H01L29/45
Foreign References:
| JP2007194514A | 2007-08-02 | |||
| JP2015053455A | 2015-03-19 |
Attorney, Agent or Firm:
IMASHITA, Katsuhiro et al. (JP)
Download PDF: